Sandisk Technologies Inc.

Bing Zhou

Senaka Kanakamedala

Raghuveer S Makala

Rahul Sharangpani

Adarsh Rajashekhar

Kartik Sondhi

Roshan Jayakhar Tirukkonda

Fei Zhou

A method of patterning a structure includes forming an alternating stack of first material layers and second material layers over a substrate, forming an etch mask material layer over the alternating stack, forming openings in an upper portion of the alternating stack by performing a first anisotropic etch process that transfers a pattern in the etch mask material layer through a first subset of layers within the alternating stack, anisotropically depositing a cladding material on the etch mask material layer to form a cladding material layer, ion implanting dopant atoms into the cladding material layer, and vertically extending the openings downward in the alternating stack by performing a second anisotropic etch process. The dopant atoms decrease an etch rate of the cladding material layer during the second anisotropic etch process.

Method of making high aspect ratio openings in a semiconductor device using ion implanted regrown cladding mask

A method of forming a memory device includes forming an alternating stack of insulating layers including a first insulating material and sacrificial material layers including a first sacrificial material over a substrate, forming a memory opening through the alternating stack, performing a first selective material deposition process that selectively grows a second sacrificial material from physically exposed surfaces of the sacrificial material layers to form a vertical stack of sacrificial material portions; forming a memory opening fill structure in the memory opening, where the memory opening fill structure includes a vertical stack of memory elements and a vertical semiconductor channel, and replacing a combination of the vertical stack of sacrificial material portions and the sacrificial material layers with electrically conductive layers.

Three-dimensional memory device and method of making thereof by non-conformal selective deposition of insulating spacers in a memory opening

A first-tier alternating stack of first-tier insulating layers and first-tier sacrificial material layers is formed over a substrate. A first-tier memory opening is formed, and is filled with a first-tier sacrificial memory opening fill structure. A second-tier alternating stack of second-tier insulating layers and second-tier sacrificial material layers is formed. An etch mask layer is formed, and a second-tier memory opening is formed through the second-tier alternating stack. An etch mask removal process is performed which collaterally removes a top portion of the first-tier sacrificial memory opening fill structure. A sacrificial pillar structure is formed by performing a selective material deposition process. An inter-tier memory opening is formed by removing the first-tier sacrificial memory opening fill structure and at least a central portion of the sacrificial pillar structure. A memory opening fill structure is formed, and the sacrificial material layers are replaced with electrically conductive layers.

Three-dimensional memory device and method of making thereof using sacrificial material regrowth

A method of forming a structure includes forming an alternating stack of first material layers and second material layers over a substrate, forming a first etch mask material layer, forming a first cladding liner, and forming a via opening through the alternating stack by performing an anisotropic etch process that employs a combination of at least the first cladding liner and the first etch mask material layer as a composite etch mask structure.

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San Jose, CA, United States of America

Bing Zhou