Industrial Technology Research Institute

Bing-Ru Chen

Wu-Cheng Kuo

Hsiao-Wen Lee

Hung-Lieh Hu

Ming-Hung Chen

Jui-Ping Weng

Chih-Tsung Shih

Chen-Peng Hsu

Shih-Yi Wen

Ya-Hui Chiang

Hsin-Yun Tsai

Kuan-Chieh Tu

Shih-Tsai Huang

Kuo-Hsiang Chen

Yeh-I Su

A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.

Light-emitting diode package having electrostatic discharge protection function and method of fabricating the same

An illumination device includes a light source positioned on an illumination axis, a lens assembly having at least two biconvex lenses disposed on the illumination axis, and a reflector having a reflecting surface enclosing the lens assembly. The light source emits a first group of light beams which directly impinge of the lens assembly, and a second group of light beams which directly impinge on the reflector. The second group of light beams being reflected by the reflecting surface such that they surround the first group of light beams after being refracted by the lens assembly, without such second group of light beams impinging on the lens assembly.

Illumination device having bi-convex lens assembly and coaxial concave reflector

A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

Light emitting diode package and process of making the same

An electrostatic movable micro mirror chip includes an upper mirror plate and a lower electrode plate positioned and jointed together via pairs of fitting solder and positioning grooves. It improves the optical quality of the mirror chip by a lower joining temperature. The fitting and jointing achieves easy positioning and interconnection. The fabrication time and cost is less. The mirror in the mirror chip is plated with metallic coating on both sides so as to balance the stress and improve its flatness.

Electrostatic movable micro mirror chip

Growing community of inventors

Pingtung County, Taiwan

Bing-Ru Chen