Hon Hai Precision Industry Co., Ltd.

Miics & Partners (shenzhen) Co., Ltd.

Bing-Heng Lee

Feng-Yuen Dai

Kuo-Fong Tseng

Chung-Pei Wang

Jih-Chen Liu

Hung-Lien Yeh

A method for cutting glass is disclosed. A glass substrate is provided, the glass substrate includes at least one cutting surface, some micro-fractures are formed on the cutting surface. A conductivity material is provided and coated on the cutting surface to form a conductivity material layer. The conductivity material layer can absorb laser energy. The conductivity material layer is irradiated by laser. The glass substrate adjoined to the cutting surface is fused to repair the micro-fractures.

Method for cutting glass

In a method, a substrate is provided and is implanted with argon ions to form an argon ion modified layer. Two slots are defined and extend through the argon ion modified layer to form a ridge. The substrate is etched to change the ridge into a beveled ridge. An etching rate of the argon ion modified layer is higher than that of the substrate. The beveled ridge is diffused with metal to form a beveled ridge waveguide.

Optical waveguide and method for manufacturing same

An optical connection includes a male connector and a female connector, the connector offers electrical connections in the manner and the size of a USB connector, together with an integral and uncouplable optical connection. The first optical connector is shielded by a first shielding member from damage and pollution at all times until the connection between the connectors is made and the second opposing optical connector enjoys the same protection. Coupling precision between the optical connectors is achieved by magnetism holding the optical connectors together.

Self-protecting optical connector

A cleaning device includes a cleaning portion and a driving portion. One end of the cleaning portion includes a cleaning head configured to clean an object to be cleaned. A spiral shaped guide groove is defined in an outside surface of the cleaning head. The driving portion includes a protruding portion. The protruding portion is movably received in the spiral shaped guide groove. When the cleaning head is resisted to the object to be cleaned, and the driving portion moves toward the object to be cleaned, the protruding portion slides along the spiral shaped guide groove to drive the cleaning head to rotate to clean the object to be cleaned.

Cleaning device

An optical printed circuit board includes a substrate, a first cladding layer, a core layer, and a second cladding layer. The first cladding layer is formed on the substrate and defines a receiving groove. The core layer is received in the receiving groove. The second cladding layer is formed on the core layer. The refractive index of the core layer is greater than that of the first cladding layer and that of the second cladding layer. The core layer includes a bottom surface, a first refractive surface, and a second refractive surface. An included angle between the bottom surface and the first refractive surface is about 135 degrees. An included angle between the bottom surface and the second refractive surface is about 135 degrees.

Optical printed circuit board, apparatus and method for manufacturing same

An electronic incense-stick assembly includes a burning chamber, a number of electronic sticks simulating burning sticks, a wind speed sensor and a controller. The electronic sticks are arranged in the burning chamber. Each of the electronic sticks includes a light guide bar, a glowing end, and a light source. The light guide bar includes a first end and a second end away from the first end. The light source is positioned at the first end. The glowing head is positioned at the second end and simulates the glowing tip of an incense stick. The wind speed sensor is located on the exterior of the burning chamber, and senses changes in the wind speed outside the burning chamber. The controller adjusts the brightness of the light source according to the wind speed sensed by the wind speed sensor.

Electronic stick assembly

A USB connector cleaner for cleaning conductive pins received in a recess of a USB connector is provided. The USB connector cleaner includes a base, a cleaning head, and a driving member. The cleaning head is configured for inserting into the recess to clean the conductive pins. The cleaning head includes a supporting member fixed on the base and a cleaning brush rotatably connected to the supporting member. The driving member is slidably connected to the base for driving the cleaning brush to cleaning the conductive pins.

USB connector cleaner

An optical transmission module includes a printed circuit board (PCB) including a first surface and an opposite second surface, a ceramic substrate mounted on the first surface, a light emitting diode and a photodiode carried on the ceramic substrate, an optical printed circuit board (OPCB) mounted on the second surface, a first reflective unit and, and a second reflective unit. The OPCB includes a flexible substrate which carries a first planar optical wave guide corresponding the first reflective unit and a second planar optical wave guide corresponding the second reflective unit. The PCB defines a first through hole aligned with the light emitting diode and the first reflective unit and a second through hole aligned with the photodiode and the second reflective unit.

Optical transmission module avoiding signal loss

A computer data transmission system includes a CPU, a photoelectrical conversion module electrically connected to the CPU, a plurality of I/O interface cards, and a plurality of first optical fibers. The photoelectrical conversion module includes a plurality of photoelectrical conversion units. Each I/O interface card includes at least one photoelectrical conversion unit for converting electrical signals to optical signals or converting optical signals to electrical signals. The first optical fibers connect the photoelectrical conversion units of the I/O interface cards and the photoelectrical conversion units of the photoelectrical conversion module. The photoelectrical conversion unit of the photoelectrical conversion module receives electrical signals outputted by the CPU, and convert the electrical signals to optical signals. The converted optical signals are transmitted to the photoelectrical conversion unit of the I/O interface card, and the photoelectrical conversion unit of the I/O interface card converts the optical signals to electrical signals.

Computer and computer data transmission system

An optical coupling module includes a substrate, a circuit board defining two through holes, an optical waveguide positioned between the substrate and the circuit board, and an optical assembly. The optical waveguide includes a core and a clad, each core comprises two coupling surfaces corresponding to the two through holes. At least one coupling surfaces is in an arcuate shape. The clad covers the core, except for the two coupling surfaces exposing out of the clad. The optical assembly formed on the circuit board comprises an optical emitting element and an optical receiving element. The optical emitting element and the optical receiving element are positioned above the two through holes, respectively. Light emitted from the optical emitting element enters the optical waveguide via one of the coupling surface, and leaves from another coupling surface to reach the optical receiving element. The coupling surface is capability of focusing light.

Optical coupling module and method for manufacturing the same

In a testing method for an LD, an LD die is held. Then, electric current increasing with a fixed increment and having a sequence of current values is supplied to the LD die to drive the LD die to emit light and a sequence of voltage values across the LD die and corresponding to the sequence of current values, respectively, is metered. A sequence of power values corresponding to the sequence of current values, respectively, is also metered. Next, an electro-optical property of the LD die is determined according to the sequence of current values, the sequence of voltage values, and the sequence of power values. Finally, if the LD die is determined to be qualified based upon the electro-optical property of the LD die, the LD die is packaged into the LD.

Growing community of inventors

Taipei, Taiwan

Bing-Heng Lee