International Business Machines Corporation

Globalfoundries Inc.

Globalfoundries U.S. 2 LLC

Front Edge Technology, Inc.

Bing Dang

John Ulrich Knickerbocker

Qianwen Chen

Paul Stephen Andry

Jeffrey Donald Gelorme

Li-Wen Hung

Jae-Woong Nah

Steven Lorenz Wright

Bucknell Chapman Webb

Cornelia Kang-I Tsang

Russell Alan Budd

Duixian Liu

Yang Liu

Cornelia Tsang Yang

Frank Robert Libsch

Jean-Olivier Plouchart

Yu Luo

Bo Wen

Devendra K Sadana

Stephen W Bedell

Ning Li

Rajeev Narayanan

Minhua Lu

Robert J Polastre

Cornelia K Tsang

Robert E Trzcinski

Peter Jerome Sorce

Joana Sofia Branquinho Teresa Maria

Alberto Valdes-Garcia

Eric Peter Lewandowski

Luc Gilbert Guerin

Joana S B T Maria

Michael A Gaynes

Peter Alfred Gruber

Mario John Interrante

Raymond R Horton

Jeffrey L Rogers

David Hirsch Danovitch

Chirag Suryakant Patel

Leanna Pancoast

Paul Alfred Lauro

Lubomyr Taras Romankiw

Tymon Barwicz

Benjamin V Fasano

Katsuyuki Sakuma

Steven Alan Cordes

Sung Kwon Kang

Paul Francis Fortier

Hongbo Peng

S Jay Chey

William E Bernier

Son K Tran

Sylvain E Ouimet

Adinath S Narasgond

Aparna Prabhakar

Maurice Mason

Lavanya Turlapati

Kenneth F Latzko

Joana Maria

Kai Liu

Arvind Kumar

Da-Yuan Shih

Sufi Zafar

Joshua M Rubin

Michael Jay Shapiro

Spyridon Skordas

Douglas C La Tulipe, Jr

Sarah Huffsmith Knickerbocker

Gregory M Fritz

Kevin R Winstel

Matthew J Farinelli

Jenna Reinen

Van Thanh Truong

William S Graham

Richard F Levine

Marlon Agno

Tung-hsiu Shih

Mengnian Niu

Kai-wei Nieh

Frank F Libsch

Loïc Marnat

Atif Shamim

Cornelia K-i Tsang

Chrirag S Patel

Aparna Prahbakar

Po-wen Cheng

Embodiments of the present invention provide an oral device. According to one embodiment of the present invention, a mouthpiece suitable to detachably engage teeth of an upper jaw is provided. The mouthpiece comprises an adhesive layer configured to attach a hermetically sealed chamber to the mouthpiece. The hermitically sealed chamber fits within a concave space created by the mouthpiece. The hermitically sealed chamber comprises two layers and embedded between those two layers are a pressure sensor, a microphone, an optical sensor, a temperature sensor, a communications module, a storage enclosure, and a biosensor. Each of the pressure sensor, the microphone, the optical sensor, the temperature sensor, the communications module, the storage enclosure, and the biosensor are operably connected within the hermetically sealed chamber.

Embedded oral sensor platform

A mechanism is provided in a data processing system to implement a multi-sensor health monitoring platform. The mechanism applies a machine learning model to predict patient needs and patient activity trends based on physiological features and activity features of the patient. The mechanism applies the machine learning model to predict energy requirements for a plurality of medical sensors based on the predicted patient needs and patient activity trends. The mechanism schedules recharging of the plurality of medical sensors based on the predicted energy requirements and identifying one or more sensors to set to an activate state based on the predicted patient needs and patient activity trends. The mechanism collecting sensor data from the one or more sensors and applies the machine learning model to generate a point-of-care recommendation based on the collected sensor data.

Multi-sensor platform for health monitoring

Thin Film Batteries are made of battery layers. Each battery layer has a substrate with one or more battery structures on the substrate surface. The battery structures have a first electrode connection and a second electrode, a first electrode (e.g. a cathode or anode) is electrically connected to the first electrode connection and a second electrode (e.g. an anode or cathode) is electrically connected to the second electrode connection. An electrolyte is at least partial disposed between and electrically connected to the first and second electrodes. A first edge connection on one of the substrate edges is physically and electrically connected to the first electrode connection. A second edge connection on one of the substrate edges is physically and electrically connected to the second electrode connection. An electrically insulating lamination is disposed on the substrate and covers the components except for the first and second edge connections, connected to respective battery electrodes. A first stack external connection electrical connects two or more of the first edge connections and a second stack external connection electrical connects two or more of the second edge connections. A first and second battery pole are connected to the respective first and second stack external connections. The TFBs are hermetically sealed.

Thin film battery stacking

A method, a structure, and a computer system for a modular sensing unit. The structure comprises a sensor module, a power cable ribbon, and a component module, wherein the component module is in communication with and detachable from the sensor module via the power cable ribbon.

Modular sensing unit

An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection

One or more die stacks are disposed on a redistribution layer (RDL) to make an electronic package. The die stacks include a die and one or more Through Silicon Via (TSV) dies. Other components and/or layers, e.g. interposes layers, can be included in the structure. An epoxy layer disposed on the RDL top surface and surrounds and attached to all the TSV die sides and all the die sides. Testing circuitry is located in various locations in some embodiments. Locations including in the handler, die, TSV dies, interposes, etc. Testing methods are disclosed, Methods of making including 'die first' and 'die last' methods are also disclosed. Methods of making heterogenous integrated structure and the resulting structures are also disclosed, particularly for large scale, e.g. wafer and panel size, applications.

Precision thin electronics handling integration

A system for interfacing an in-body medical device with an external network includes a subdermal wideband on-body network (WON) hub, which in turn includes a hub rechargeable battery, a hub processor coupled to the hub rechargeable battery, a device interface configured to communicate with the in-body medical device, and coupled to the hub processor, and a hub-satellite near field communications wireless interface coupled to the hub processor. The system also includes a wearable WON server that in turn includes a server processor, a server-satellite interface coupled to the server processor, and an external network interface coupled to the server processor. The server processor implements a software controller; and a skin-mountable WON tethered satellite that includes a wired satellite-server interface, coupled to the wearable WON server, and a tethered satellite near-field communications (NFC) wireless interface, configured to communicate with the hub-satellite NFC wireless interface, and coupled to the wired satellite-server interface.

Medical device system

A device for detecting a tampering of a product in a product packaging material. The device comprises a network of sensors integrated into the product packaging material; a microcontroller, the microcontroller configured to detect, by accessing the sensors of the sensor network, the tampering of the product packaging material; and a communication device for relaying information regarding a status of the product packaging material.

Medication counterfeit detection

A sleeping mask includes a signal processor for processing sensor data, an infrared light source coupled to the signal processor and configured to emit infrared light toward an eyelid of a user, and an array of infrared sensors coupled to the signal processor and configured to receive infrared light reflected from the eyelid of the user.

Sleeping mask methods and panels with integrated sensors

Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.

Method of forming thin die stack assemblies

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

Miniaturized electronics package with patterned thin film solid state battery

Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.

Ultra-thin microbattery packaging and handling

A method of manufacturing a micro-battery is provided. The method includes forming a micro-battery device by forming a first metal anode via and a first metal cathode via in a first substrate, forming a first metal layer on a bottom side of the first substrate, forming a first battery element on a top side of the substrate, forming an encapsulation layer around the first battery element, forming trenches through the encapsulation layer and the first substrate on different sides of the first battery element, and forming a metal sealing layer in the trenches to cover at least a plurality of sidewall surfaces of the first battery element. The metal sealing layer is electrically connected to the battery element through the first metal layer and the first metal cathode via.

Hermetic packaging of a micro-battery device

Growing community of inventors

Chappaqua, NY, United States of America

Bing Dang