Western Digital Technologies, Inc.

Sandisk Technologies Inc.

Wangsu Science & Technology Co., Ltd.

Sandisk Information Technology (shanghai) Co., Ltd.

Binbin Zheng

Chin-Tien Chiu

Jiandi Du

Yazhou Zhang

Wenbin Qu

Sundarraj Chandran

Hem P Takiar

Li Chen

Lei Shi

Ting Liu

Chien-Te Chen

Zengyu Zhou

Rui Guo

Ye Bai

Shineng Ma

Fen Yu

Wensheng Chen

Hsiang Ju Huang

Xionglin Chen

Cheng-Hsiung Yang

Songtao Lu

Wenjuan Chen

In one example, the present application describes a Printed Circuit Board (PCB) that mitigates galvanic corrosion during an Organic Solderability Preservative (OSP) process used during fabrication of the PCB. The PCB includes a first metal pattern and a second metal pattern electrically coupled to each other, where the first and second metal patterns are different metals. The first metal pattern has a first area that is exposed by a solder mask layer, and the second metal pattern has a second area that is exposed by the solder mask area. A ratio of the first area to the second area is less than a threshold ratio to mitigate the galvanic corrosion of the second metal pattern exposed on the PCB during the OSP process.

Printed circuit board having a sacrificial pad to mitigate galvanic corrosion

A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a stack of flash memory dies mounted on a substrate. The heat dissipating module comprises a first semiconductor die such as a controller, and a second semiconductor die such as a thermoelectric semiconductor die to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at the wafer level.

Thermoelectric semiconductor device and method of making same

A semiconductor device has shielding to prevent transmission and/or reception of EMI and/or RFI radiation. The semiconductor device comprises a substrate including grounded contact pads around a periphery of the substrate, exposed at one or more edges of the substrate. A bump made of gold or other non-oxidizing conductive material may be formed on the contact pads, for example using ultrasonic welding to remove an oxidation layer between the contact pads and the conductive bumps. The conductive bumps electrically couple to a conductive coating applied around the periphery of the semiconductor device.

Semiconductor device including conductive bumps to improve EMI/RFI shielding

A semiconductor device is disclosed including a stack of wafers having a densely configured 3D array of memory die. The memory die on each wafer may be arranged in clusters, with each cluster including an optical module providing an optical interconnection for the transfer of data to and from each cluster.

Semiconductor device including optically connected wafer stack

A system, a method, and a device for network load balance processing are provided. The network load balance processing method includes: establishing, by a virtual server, connection with a client; sending, by the virtual server, a control command to a back-end server and information related to connection to the back-end server, such that the back-end server starts a connection service based on the control command directed to connection; forwarding, by the virtual server, a data request packet from the client, where the back-end server is configured to respond to the data request packet based on the connection service and send response information to the client. Through the present disclosure, the issue of high memory consumption in the network load balance processing is solved, thereby achieving an effect of low memory consumption in the network load balance processing.

System, method, and device for network load balance processing

Growing community of inventors

Shanghai, China

Binbin Zheng