Industrial Technology Research Institute

Bin-Yuan Lin

Hsin-Herng Wang

Chia-Tin Chung

Te-Yeu Su

Wun-Ku Wang

Chih-Cheng Chiang

Wen-Jer Chen

Der-Tarng Su

Hui-min Huang

Su-Jen Chang

Chi-Hwang Chen

Rong-Hwa Chang

Wei-Chun Yang

Hsiao-Pin Huang

Hsien-Mhing Chen

A process is disclosed for forming resistors on a printed circuit substrate. The method includes the step of applying a photoresist layer onto substrate, and forming openings in the photoresist layer to expose the preselected regions for resistors, such that polymer thick resist pastes as well as resistive metallic films can be applied onto the substrate through these openings with precise geometry. The process according to the invention has higher accuracy and greater processing flexibility than the prior art processes where the resistor pastes are directly applied onto the substrate by screen printing.

Process for forming polymer thick film resistors and metal thin film resistors on a printed circuit substrate

A novel PTC conductive polymer composition is disclosed, which comprises (a) 35 to 60%, by weight of the composition, of a branched polyolefin with a polydispersity index of less than 2.5; and (b) 20 to 45%, by weight of the composition, of conductive particles which have been dispersed in the polyolefin. The PTC composition of the invention has intense, reproducible PTC behavior and is particularly suitable for use in PTC thermistors.

PTC conductive polymer composition

The present invention uses high molecular weight polyethene glycol copolymer with high antistatic property, and other solubilizer agent to proceed blending and enhancing the co-solublization property of the polyamide. The long-term antistatic plastic particles obtained by blending the modified antistatic composition and the polyamide material are made into different articles according to various composites. The molded articles are divided into three types: (1) an antistatic polyamide article with surface resistance of about 10.sup.10 -10.sup.11 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 1.5 sec; (2) an antistatic polyamide fiber with surface resistance of about 6.times.l0.sup.10 -1.2.times.10.sup.12 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 60 sec; (3) a polishing resistant antistatic polyamide with surface resistance of about 10.sup.10 -10.sup.11 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 1.5 sec.

Long-term antistatic composition

Polymer thick film resistor pastes with dimensionally stability and excellent processibility, such as coating, printing, and extruding, are disclosed. The resistor paste composition in accordance with the present invention comprises a low-k cycloaliphatic epoxy resin vehicle loaded with electrically conductive particles, a cationic photoinitiator, a thermal catalyst, and optionally a reactive diluent.

Polymer thick film resistor pastes

Laminar articles having improved barrier properties to organic solvents and gases, fabricated directly from polyolefin and modified polyamide, are disclosed. The modified polyamide is a blend of 97-40 wt % polyamide and 3-60 wt % of compatabilizer which is a polyether ester amide block copolymer or a mixture of the block copolymer and alkylcarboxyl-substituted polyolefin.

Thermoplastic polyolefin resin composition and laminar articles having

A rapidly crystallizing polyphenylene sulfide composition for reducing duration of injection molding cycle which comprises (a) a polyphenylene sulfide represented by the formula: ##STR1## and (b) an organometallic compound represented by the formula:

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Hsinchu Hsien, Taiwan

Bin-Yuan Lin