Cabot Microelectronics Corporation

Bin Lu

Shumin Wang

Yuchun Wang

John C Parker

Renjie Zhou

Fred Sun

Jason Aggio

Ethan K Lightle

John Parker

The invention provides compositions and methods for planarizing or polishing a surface. One composition comprises about 0.01 wt. % to about 20 wt. % &#x3b1;-alumina particles, wherein the &#x3b1;-alumina particles have an average diameter of 200 nm or less, and 80% of the &#x3b1;-alumina particles have a diameter of about 500 nm or less, an organic acid, a corrosion inhibitor, and water. Another composition comprises &#x3b1;-alumina particles, an organic acid, dual corrosion inhibitors of triazole and benzotriazole, wherein the wt. % ratio of the triazole to benzotriazole is about 0.1 to about 4.8, and water.

Composition and method for planarizing surfaces

The invention provides a method of polishing a substrate, which method comprises the steps of (i) providing a polishing composition, (ii) providing a substrate comprising at least one metal layer, and (iii) abrading at least a portion of the metal layer with the polishing composition to polish the substrate. The polishing composition comprises an abrasive and a liquid carrier, wherein the abrasive comprises metal oxide particles having a surface with a silane compound adhered to a portion thereof and a polymer adhered to the silane compound and wherein the polymer is selected from the group consisting of water-soluble polymers and water-emulsifiable polymers. The invention also provides a polishing composition as described above, wherein the total amount of abrasive particles present in the polishing composition is no greater than about 20% by weight of the polishing composition, and the metal oxide particles do not comprise zirconia.

Coated metal oxide particles for CMP

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Naperville, IL, United States of America

Bin Lu