Intel Corporation

Huawei Technologies Co., Limited

Shanghai Xinlong Semiconductor Technology Co., Ltd.

Abb Schweiz Ag

Trane International Inc.

Chinese Academy of Sciences

Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Delta Electronics (Shanghai) Co., Ltd

China Unionpay Co., Ltd.

Zhejiang Hisun Pharmaceutical Co., Ltd.

Shinn Fu Corporation

Leica Microsystems Ltd., Shanghai

Cstone Pharmaceuticals

Cstone Pharmaceuticals (Shanghai) Co., Ltd.

Cstone Pharmaceuticals (Suzhou) Co., Ltd.

Bin Liu

Wei Chi

Shuhui Chen

Jian Wang

Li Deng

Lili Zhang

Da Wang

Yong She

Zhicheng Ding

Aiping Tan

Zhijun Xu

Ruiping Li

Jun Yang

John G Meyers

Fei Huang

Jing Ma

Said Zahrai

Jinlong Xu

Huang Duan

Xuesong Pan

Hongming Wang

Yi Zhang

Jian-Ping Ying

Hao Wu

Kai Chen

Yi Bu Li

Wei Wang

Tao Zhang

Zheng Wang

Hua Bai

Hong-Jian Gan

Florence R Pon

Hua Cai

Yong Cheng

Hyoung Il Kim

Song Liu

Bo Wang

Yanliang Sun

Changqing Wei

Jinming Zhang

Jingjing Zhang

Jing Wu

Mao Guo

Qiang Guo

Kaiyuan Cao

Xiaohe Zheng

Quansheng Liu

Peng Sun

Xiaoyu Liu

Yonggang Liao

Chunhui Le

Bing Xu

Guohui Han

Yuhan Sun

Yisheng Fu

Xiaoyong Yu

Hui Yu

Yao Xiao

Yanqiang Huang

Huawei Ju

Xingjie Li

Dongfei Wang

Zhi She

Yixiu Hao

Cen Ling

Zhen Shi

Zhenyuan Chen

Yaning Xiao

Yingqiu Wu

Fei Yu

Xudong Tian

Junjie Hu

Jianzhao Wu

Xueqin Gu

Yaping Wang

Liangshu Zhong

Beibei Chen

Tiejun Lin

Hongyan Li

Huachun Zhan

Jianhu Wang

Hongbin Yang

Puyao Qiao

Lianqi Wu

Yicheng Zheng

Yusheng Cai

Jiabei Shi

Guizhi Shi

Wenxuan Wu

Heng Xie

Lingyan L Tan

Guifen Zhang

Xiaoying Tang

Zhengjia Li

Hai Zhen Lv

Yunlei An

Xingzhen Qi

Guojun Zheng

Richard Stirling-Gallacher

A file sharing method includes that a first mobile terminal establishes a connection to a second mobile terminal. The first mobile terminal displays at least two windows. One of the window includes at least one first file stored in the first mobile terminal, the other window includes a file directory of the second mobile terminal, and the file directory includes at least a first folder. The first mobile terminal sends the first file to the second mobile terminal in response to an operation performed by a user on the first file.

File sharing method of mobile terminal and device

A notification processing method includes: displaying a first window and a second window in a display screen by regions; and popping up, in response to a preset operation on the first window, a first notification bar corresponding to the first window, and displaying, in the first notification bar, a current notification message of the first window or a notification message of a current application corresponding to the first window.

Notification processing method and apparatus, terminal, and storage medium

A short-circuit protection circuit, chip and system for a switched-mode power supply are disclosed. The short-circuit protection circuit includes: a sampling module for sampling an input voltage and producing a first voltage from the input voltage; a generation module for generating a second voltage from a reference voltage; a comparison module for comparing the first voltage and the second voltage; and an output module for producing, from a result of the comparison performed by the comparison module, and outputting a control signal for controlling an external power transistor in the event of a short circuit in the switched-mode power supply. According to the present invention, when an output short circuit is detected, a hiccup-mode duty cycle is adjusted according to the input voltage, thus avoiding great energy loss when the input voltage is high and enabling loaded startup or automatic output recovery after the short circuit condition is removed when the input voltage is low.

Short-circuit protection circuit, chip and system for switched-mode power supply

A photographing method and a terminal device are disclosed. The method includes: receiving, by a terminal device, a first operation; starting, by the terminal device, a camera in response to the first operation; displaying, by the terminal device, a first preview screen including a first preview image, where the first preview image includes at least one photographed object, and the at least one photographed object in the first preview image matches preset first text information; and outputting, by the terminal device, first prompt information based on the first preview image and the first text information, where the first prompt information is used to indicate a missing or redundant photographed object in the first preview image. Indicated by the prompt information, a user can move a position or an angle of the terminal device.

Method and terminal device for matching photographed objects and preset text information

A method for processing an uplink reference signal includes determining a current baseband processing payload, and processing each of N received uplink reference signals according to a preset first condition in response to the baseband processing payload being less than a first preset value or processing each uplink reference signal in a signal set according to a preset second condition in response to the baseband processing payload being greater than a second preset value. The second preset value is greater than or equal to the first preset value. The signal set includes one or more of the N uplink reference signals. A baseband processing payload corresponding to processing an uplink reference signal according to the preset second condition is less than a baseband processing payload corresponding to processing an uplink reference signal according to the preset first condition. N is a positive integer.

Method for processing uplink reference signal and related apparatus

A current limit control circuit and a switched-mode power supply chip incorporating the current limit control circuit are disclosed. The current limit control circuit includes an output current sampling module, a first voltage comparator module, a hysteresis comparator module, a logic control module, a capacitor charging/discharging module and a current limit control module. The capacitor charging/discharging module is configured to charge/discharge a capacitor and thus change its output voltage, and the hysteresis comparator module is configured to produce a current limit control signal which allows the switched-mode power supply to output a high current for a specified period of time. Upon elapse of the period, the power transistor is controlled to cause a low current to be output. This ensures that the demand of a load for a transient current is satisfied while ensuring safe and stable operation of the chip for a long time.

Current limit control circuit and switched-mode power supply chip incorporating same

Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a package substrate with a top surface, a corner portion, and a plurality of solder balls on the top surface of the package substrate. The semiconductor package also includes a pattern on the corner portion of the package substrate. The pattern may have a width substantially equal to a width of the solder balls. The pattern may also include a continuous line having solder materials. The semiconductor package may include a plurality of conductive pads on the package substrate. The conductive pads may be coupled to the pattern. The pattern may have a z-height that is substantially equal to a z-height of the solder balls, and have one or more outer edges, where the outer edges of the pattern are sidewalls. The sidewalls of the pattern may be substantially vertical or tapered sidewalls.

Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement

A switched-mode power supply (SMPS) chip and system are disclosed, which are used for determining a maximum power output of a solar photovoltaic panel connected to the SMPS chip. The SMPS chip includes a sampled current comparator module, a logic control module connected to the sampled current comparator module, and a charge/discharge control module connected to the logic control module. According to the present invention, an output current from the SMPS system to an external load is detected and serves as a basis for incrementally adjusting a minimum input voltage of the SMPS chip and hence an output voltage of the solar photovoltaic panel. In this way, an output voltage level of solar photovoltaic panel corresponding to the maximum power output thereof under a given condition can be determined. Through keeping the solar photovoltaic panel operating at that output voltage level, it is ensured that the solar photovoltaic panel provides the maximum power output under the given condition.

Switch power supply chip and system

A driving circuit of a light-emitting device, a backlight module and a display panel are disclosed in the present disclosure. The driving circuit of the light-emitting device includes a light-emitting device, a driving transistor, a data signal writing module, a first power signal writing module, a second power signal writing module, a light-emitting control module, and a storage module.

Driving circuit of light-emitting device, backlight module and display panel

A packaged device () includes a substrate () and one or more contacts () disposed on a side of the substrate (). Structures of the packaged device () define at least in part a recess region () that extends from the side of the substrate () and through the substrate (), where one or more contacts () of a second hardware interface are disposed in the recess region (). The one or more contacts () of the first hardware interface enable connection of the packaged device () to a printed circuit board. The one or more contacts () of the second hardware interface enable connection between one or more IC dies of the packaged device () and another IC die () that is a component of the packaged device () or of a different packaged device.

Packaged integrated circuit device with recess structure

An apparatus comprising: a die stack comprising at least one die pair, the at least one die pair having a first die over a second die, the first die and the second die both having a first surface and a second surface, the second surface of the first die over the first surface of the second die; and an adhesive film between the first die and the second die of the at least one die pair; wherein the adhesive film comprises an insulating layer and a conductive layer, the insulating layer adhering to the second surface of the first die and the conductive layer adhering to the first surface of the second die.

Power enhanced stacked chip scale package solution with integrated die attach film

A microelectronic device can include a polymer, a semiconductor, and a matching layer. The polymer can include a first coefficient of thermal expansion. The semiconductor can be coupled to the polymer layer. The matching layer can be adjacent the semiconductor, and the matching layer can include a second coefficient of thermal expansion that is about the same as the first coefficient of thermal expansion.

Die stack with reduced warpage

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include an electronic component, a redistribution layer, and an interposer electrically coupling the redistribution layer and the electronic component. The interposer can have interconnect interfaces on a top side electrically coupled to the electronic component and interconnect interfaces on a bottom side electrically coupled to the redistribution layer. A density of the interconnect interfaces on the top side can be greater than a density of the interconnect interfaces on the bottom side. Associated systems and methods are also disclosed.

Electronic device package

A beam selection method includes determining, by a terminal, a first angular power spectrum of a low frequency channel transmitted between the terminal and an access network device, determining, by the terminal, a first high frequency beam scanning range based on the first angular power spectrum, and scanning, by the terminal, the first high frequency beam scanning range for a high frequency beam of the access network device.

Beam selection method and apparatus

A pixel circuit and a display panel are disclosed. The pixel circuit includes a first and a second power supply lines, a light-emitting element, a driving TFT, a storage capacitor, a writing TFT, a first, a second, and a third compensation TFTs. The storage capacitor is electrically connected to the driving TFT, the writing TFT is electrically connected to the driving TFT, the first compensation TFT is electrically connected to the driving TFT, the storage capacitor, and the driving TFT, the second compensation TFT is electrically connected to the storage capacitor and the first compensation TFT, the third compensation TFT is electrically connected to the storage capacitor, and the third compensation TFT is electrically connected to the light-emitting element.

Pixel circuit and display panel comprising working stages

Growing community of inventors

Shanghai, China

Bin Liu