Harvatek Corporation

Youngtek Electronics Corporation

Other

Harvatek Corportion

Bily Wang

Jonnie Chuang

Kuei-Pao Chen

Shih-Yu Wu

Wen-Kuei Wu

Hui-Yen Huang

Hsin-Cheng Chen

Bill Chang

Ping-Chou Yang

Chao-Yuan Huang

Sung-Yi Hsiao

Jack Chen

Chuanfa Lin

Chih-Ming Wang

Jia-Wen Chen

Heng-Yen Lee

Chi-Wen Hung

Yuan-Hsiu Yang

Yann Lee

Chia-Hung Chen

Hui-Chung Lin

John Lin

Hui Yen Huang

Ming-Hao Chou

Chuan-Fa Lin

Hung-Chou Yang

Hsiu-Wen Wang

Chi-Tseng Chang

Jeng-Ru Chang

Chi-Kang Lo

Ren-Chun Ni

Chung-Hsien Su

Tzyy Jang Tseng

Chin-Mau James Hwang

Zhen-Hao Fan

Kuo-Lung Kuo

Chun-Cheng Weng

Cheng-Chin Chiu

Cheng-Yen Chiang

Chung-Ho Chen

Alen Ke

Yu-Jen Cheng

Huang Hui Yen

Jui-Wen Pan

Miko Huang

Zhen Hao Fan

Chih Shan Yu

A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.

Packaged chip detection and classification device

A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit. Therefore, the optical fiber cables received in the corresponding receiving space, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.

Light-guiding cover structure

A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip is received in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed between the conductive pads to insulate the conductive pads. The first conductive layers are formed on the first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same

An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.

LED package chip classification system

An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.

LED chip package structure using sedimentation and method for making the same

A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.

Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach

A simple detachable illumination lamp tube includes a tube unit, a heat-dissipating unit, a light-emitting unit, a support unit and a lateral cover unit. The tube unit has a light-permitting hollow tube. The heat-dissipating unit has a heat-dissipating substrate received in the light-permitting hollow tube. The heat-dissipating substrate has two opposite lateral sides contacting the inner surface of the light-permitting hollow tube. The light-emitting unit has a plurality of strip light-emitting modules received in the light-permitting hollow tube. The strip light-emitting modules are disposed on the heat-dissipating substrate and electrically connected in sequence. The support unit has a plurality of support elements received in the light-permitting hollow tube and disposed between a bottom side of the heat-dissipating substrate and the inner surface of the light-permitting hollow tube. The lateral cover unit has two lateral covers installed on two ends of the light-permitting hollow tube.

Simple detachable illumination structure and lamp tube

A multi-track detection system for detecting the appearance of electronic elements includes a rotary module, a feeding module, an unvibrated module, a detection module, and a classification module. The rotary module includes a hollow transparent rotary structure having at least two annular guiding areas on the top surface thereof, and the electronic elements are sequentially arranged on the two annular guiding area. The feeding module has two V-shaped feeding grooves for guiding the electronic elements. The unvibrated module includes an unvibrated guiding block having two V-shaped unvibrated guiding grooves respectively communicated with the two V-shaped feeding grooves and respectively corresponding to the two annular guiding areas. The electronic elements on the V-shaped feeding grooves are sequentially transmitted onto the two annular guiding areas through two V-shaped unvibrated guiding grooves, thus each electronic element can be detected by the detection module and classified by the classification module, respectively.

Multi-track detection system for detecting the appearance of electronic elements

A light-emitting element detection and classification device includes a rotation unit for transporting a plurality of light-emitting elements, a chip detection unit, and a chip classification unit. The rotation unit includes at least one rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions, each receiving portion selectively receives at least one of the light-emitting elements. Each light-emitting element is an LED package chip having a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip detection unit includes at least one chip detection module adjacent to the rotation unit for detecting each light-emitting element. The chip classification unit includes at least one chip classification module adjacent to the rotation unit for classifying the LED package chips that have been detected by the at least one chip detection module.

Light-emitting element detection and classification device

A GPS device with a display function includes a GPS recorder and a display screen. The GPS recorder has a GPS casing that encloses one part of the display screen and only a display area of the display screen is exposed. The display screen is electrically disposed on the GPS recorder, and the display screen displays pattern in order to show time information and the position information that have been captured by the GPS recorder. In addition, the GPS recorder has a memory disposed therein for storing the time information and the position information.

GPS device with a display function and method for using the same

A lamp head assembly includes an outer head unit, an inner head unit, and an elastic pressing unit. The outer head unit includes at least two conductive pins. The inner head unit is disposed rotatably in the outer head unit. The elastic pressing unit is disposed movably in the outer head unit for selectively positioning the position of the inner head unit relative to the outer head unit or the position of the outer head unit relative to the inner head unit, wherein the elastic pressing unit includes a pressing element selectively exposed from the outer head unit.

Lamp head assembly and lighting lamp tube

Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same

An LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature includes a substrate unit, a light-emitting unit, a transparent colloid body unit, a fluorescent colloid body unit and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The transparent colloid body unit has a plurality of transparent colloid bodies respectively covering the LED chips. The fluorescent colloid body unit has a plurality of fluorescent colloid bodies respectively covering the transparent colloid bodies. The frame unit is covering the peripheries of each transparent colloid body and each fluorescent colloid body in order to expose the top surfaces of the fluorescent colloid body.

LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same

An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.

LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same

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Hsinchu, Taiwan

Bily Wang