Motorola Corporation

Motorola Solutions, Inc.

Billy J Van Cannon

Herman J Miller

John M Waldvogel

Brian R Bielick

Apolinar Chaidez

Theodore M Lietz

One provides () both an in-phase signal component () and a quadrature signal component () wherein the latter has a non-zero portion. These two signal components are then combined () to provide a Cartesian training waveform that can be used when training a linear amplifier that uses Cartesian feedback linearization. By one approach, the non-zero portion of the quadrature signal component can be coincident with a zero-crossing portion of the in-phase signal. In many application settings this non-zero portion of the quadrature signal component can be less (and sometimes considerably less) than a peak amplitude of the in-phase signal component. One may also shape the in-phase signal component to have a smoothed envelope. This may include, for example, using a smoothed sine wave such as a raised-sine function.

Method and apparatus for providing a Cartesian training waveform

An electrical circuit apparatus () that includes: a substrate () having a ground layer (), at least one thermal aperture (), and at least one solder aperture (); a heat sink (); and an adhesive layer () for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture () and at least one solder aperture (), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Electrical circuit apparatus and methods for assembling same

An electrical circuit apparatus () that includes: a substrate () having a ground layer (), at least one device aperture (), and at least one solder aperture (); a heat sink (); and an adhesive layer () for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Electrical circuit apparatus and method

Electrical circuit apparatus and method for assembling same

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Chicago, IL, United States of America

Billy J Van Cannon