Raytheon Company

Texas Instruments Corporation

Billy D Ables

John Charles Ehmke

Roland W Gooch

Charles L Goldsmith

James L Cheever

James R Chow

Kurt S Ketola

David T Winslow

Sankerlingam Rajendran

Alberto F Viscarra

Rohn Sauer

Kevin C Rolston

Kurt J Krause

Gordon D Merritt

A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.

Process for fabricating a three dimensional molded feed structure

A hermetically sealed package includes a lid () hermetically bonded to a wafer or substrate (), with a chamber therebetween defined by a recess () in the lid. A circuit device () such as MEMS device is provided within the chamber on the substrate. A plurality of vias (-) are provided through the substrate, and each have a structure which facilitates a hermetic seal of a suitable level between opposite sides of the substrate. The vias provide electrical communication from externally of the assembly to the device disposed in the chamber.

Method and apparatus for packaging circuit devices

According to one embodiment, a pattern forming system includes a patterning tool, a multi-axis robot, and a simulation tool that are coupled to a pattern forming tool that is executed on a suitable computing system. The pattern forming tool receives a contour measurement from the patterning tool and transmits the measured contour to the simulation tool to model the electrical characteristics of a conductive pattern or a dielectric pattern on the measured contour. Upon receipt of the modeled characteristics, the pattern forming system may adjust one or more dimensions of the pattern according to the model, and subsequently create, using the patterning tool, the corrected pattern on the surface.

System for forming patterns on a multi-curved surface

RF MicroElectroMechanical Systems (MEMS) circuitry ( ) on a first high resistivity substrate ( ) is combined with circuitry ( ) on a second low resistivity substrate ( ) by overlapping the first high resistivity substrate ( ) and MEMS circuitry ( ) with the low resistivity substrate ( ) and circuitry ( ) with the MEMS circuitry ( ) facing the second circuitry ( ). A dielectric lid ( ) is placed over the MEMS circuitry ( ) and between the first substrate ( ) and second substrate ( ) with an inert gas in a gap ( ) over the MEMS circuitry ( ). Interconnecting conductors ( ) extend perpendicular and through the high resistivity substrate ( ) and through the dielectric lid ( ) to make electrical connection with the low resistivity substrate ( ).

Wafer level interconnection

RF MicroElectroMechanical Systems (MEMs) circuitry( ) on a first high resistivity substrate ( )is combined with circuitry ( ) onsecond low-resisitivity substrate ( ) by overlapping the first high resisitivity substrate ( )and MEMs circuitry ( ) with the low resisitivity substrate( ) and circuitry ( ) with the MEMs circuitry ( )facing the second circuitry ( ). A dielectric lid ( ) is placed over the MEMs circuitry ( )and between the first substrate ( )and second substrate ( )with an inert gas in a gap ( )over the MEMs circuitry ( ). Interconnecting conductors ( ) extend perpendicular and through the high resistivity substrate ( )and through the dielectric lid ( ) to make electrical connection with the low resisitivity substrate ( ).

Water level interconnection

First and second electronic devices interconnected by a nonconductive nanoporous film, said film having metal-filled pores extending through the thickness of the film, such that each of said devices is contacted by the metal in at least several pores, wherein said film comprises a silicone polymer.

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Richardson, TX, United States of America

Billy D Ables