Motorola Corporation

Bill McDonald

Bishnu Prasanna Gogoi

David Joseph Monk

Kyujin Jung

Theresa A Maudie

Dave S Mahadevan

Gordon D Bitko

Song Woon Kim

Selective encapsulation of a micro electro-mechanical pressure sensor provides for protection of the wire bands ( ) through encapsulation while permitting the pressure sensor diaphragm ( ) to be exposed to ambient pressure without encumbrance or obstruction. Selective encapsulation is made possible by the construction of a protective dam ( ) around the outer perimeter of a pressure sensor diaphragm ( ) to form a wire bond cavity region between the protective dam ( ) and the device housing ( ). The wire bond cavity may be encapsulated with an encapsulation gel ( ) or by a vent cap ( ). Alternatively, the protective dam ( ) may be formed by a glass frit pattern ( ) bonding a cap wafer ( ) to a device wafer ( ) and then dicing the two-wafer combination into individual dies with protective dams attached.

Micro electro-mechanical system sensor with selective encapsulation and method therefor

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Scottsdale, AZ, United States of America

Bill McDonald