Emcore Corporation

Opnext, Inc.

Bill H Reysen

Richard F Carson

Robert P Bryan

Frederick McCormick

Marcelino Armendariz

David W Peterson

Edwin B Duckett, Iii

Gene R Anderson

Cathleen A Reber

Dahwey Chu

Gary D Peterson

Joseph Vanniasinkam

Jon Meyer

Rachel Knudsen Giunta

Bor-Long Twu

Christopher Viray

Chris H Carroll

Robert T Mitchell

Merideth A Rising

John P Brostrom

Yeou-Yen Chen

Joseph Wai

Johnny R F Baca

Marcelino G Armendariz

Frederick B Mccormick

Edwin B Iii Duckett

A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser. The first non-opaque material may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element.

Method and apparatus for coupling optical elements to optoelectronic devices for manufacturing optical transceiver modules

Optical transceiver modules which may be attached to printed circuit boards or other planar supports are presented. The optical transceiver module includes a housing mountable on a board such that a first portion of the housing is above a plane of the board and a second portion of the housing is below the plane of the board. The board may be any planar support, including a circuit board. The plane may be any plane in the board such as a center plane, for example.

Mountable optical transceiver

A multiplexer/demultiplexer optical system component that is passively aligned upon assembly is disclosed. The optical system includes a lens block and a mirror-filter block. In some embodiments, optical filters are positioned and epoxyed to the mirror-filter block using a positioning tool. In some embodiments, optical filters are positioned and epoxyed on a support structure which has been etched to receive the optical filters. The mirror-filter block is a block having flat surfaces, one of which is a flat reflecting surface. The lens block is formed by injection molding and includes a barrel for holding and positioning an optical fiber, placement for a collimating lens, and placements for focusing lenses such that, when assembled, light incident on each of the focusing lenses propagates along the optical axis of the focusing lens. In some embodiments, the collimating lens and the focusing lenses are integrally formed with the lens block. In some embodiments, one or more of the collimating lens or focusing lenses are formed separately and inserted into holders integrally formed with the lens block to receive the lens. In some embodiments, the lens block includes a reflecting surfaces that directs light onto the focusing lenses. Assembly and alignment of the multiplexer/demultiplexer involves positioning a flat surface of the mirror-filter block against a receiving surface of the lens block with the filters between them and epoxying the components in place.

Filter based multiplexer/demultiplexer component

This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

Apparatus and method of using flexible printed circuit board in optical transceiver device

An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

Optoelectronic mounting structure

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Lafayette, CO, United States of America

Bill H Reysen