Intel Corporation

Xerox Corporation

Bijoyraj Sahu

Peter Johan Nystrom

Thomas A Boyd

Eric W Buddrius

Andrew Wayne Hays

Mark Anthony Cellura

Jeffory L Smalley

Devdatta P Kulkarni

Craig J Jahne

Carlos Alvizo Flores

Jun Zhang

Pooya Tadayon

Russell S Aoki

Damion T Searls

David Shia

Ralph V Miele

Srikant Nekkanty

Richard J Dischler

Barrett M Faneuf

Gregorio R Murtagian

Jin Yang

Hemant D Desai

Anthony P Valpiani

Andrew Larson

Kenan Huseyin Arik

Prabhakar Subrahmanyam

Christopher Wade Ackerman

Kevin Ceurter

Karumbu Meyyappan

Catharina Biber

Minh T Le

Ying-Feng Pang

Kristin L Weldon

Shelby A Ferguson

Mustafa H Haswarey

Michael Berktold

Evan A Chenelly

Yi Xia

Rolf Laido

Brendan T Pavelek

Victor Polyanko

Javier Avalos Garcia

Minh T D Le

Daniel Neumann

Yuyang Xia

Andres Ramirez Macias

Lianchang Du

Luz Karine Sandoval Granados

Mark Bianco

Adriana Lopez Iniguez

Yuehong Fan

Gilberto Rayas Paredes

Eric Jm Moret

Rachel Taylor

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Aardra B Athalye

Yuan Li

An electronic system and associated methods are disclosed. In one example, the electronic system includes an interposer including electrically conductive interposer interconnect, a first interposer surface, and a second interposer surface; a processor package including at least one processor integrated circuit (IC), the processor package attached to the first interposer surface and electrically connected to the interposer interconnect; a first liquid metal well array including multiple liquid metal wells attached to a second interposer surface and the interposer interconnect; a second liquid metal well array including a first array surface attached to the first interposer surface and the interposer interconnect; and a packaged companion IC to the processor IC attached to a second array surface of the second liquid metal well array.

Liquid metal interconnect for modular system on an interposer server architecture

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

A variable conductance heat pipe (VCHP) is utilized as a 'passive heat switch' to regulate a characteristic temperature of an integrated circuit component. The VCHP is located between an integrated circuit component and a cold plate and comprises a working fluid and a non-condensable gas in a chamber. When the component is not operational, the VCHP blocks the flow of heat from the component to the cold plate. As component power consumption increases, the working fluid pressure increases and compresses the non-condensable gas toward the cooler region of the cold plate to eventually create a low thermal resistance path between the component and the cold plate. By introducing negative feedback into the thermal management solution, the VCHP keeps the characteristic temperature within a narrow range. This can alleviate stress on package components (e.g., solder joints) due to excessive thermal cycling, which can extend the lifetime of the component.

Variable conductance heat pipes for improved reliability

A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.

Flexible and modular top and bottom side processor unit module cooling

A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

Scalable debris-free socket loading mechanism

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

Modular thermal energy management designs for data center computing

Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a substrate, a first die, a gasket, and a thermal interface. The first die may be connected to the substrate. The gasket may be connected to the substrate and may encircle the first die to form a space between the first die and the gasket. The thermal interface material may be located within the space formed by the first die and the gasket.

Mechanical seal and reservoir for microelectronic packages

A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may be individually addressable through use of an array of piezoelectric actuators. Embodiments for forming a nanoprinthead including an array of nanotip cantilevers can include an etching process from a material such as a silicon wafer, or the formation of a metal or dielectric nanotip cantilever over a substrate. The nanoprinthead may operate to provide uses for technologies such as dip-pen nanolithography, nanomachining, and nanoscratching, among others.

Printhead with nanotips for nanoscale printing and manufacturing

A method for assembling a printhead such as an ink jet printhead can include the use of a laser to bond two or more printhead layers together. In an embodiment, a laser beam is directed through a transparent layer to an energy-absorbing layer, where the energy-absorbing layer is melted such that after removal of the laser beam the melted layer solidifies to adhere the energy-absorbing layer to the transparent layer. In another embodiment, heating the energy-absorbing layer melts the transparent layer to adhere the energy-absorbing layer to the transparent layer after removal of the laser beam. The laser transmission lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.

Laser transmission laminating of materials for ink jet printheads

A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.

Ultrasonic laminating of materials for ink jet printheads

A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes.

Bonded silicon structure for high density print head

Growing community of inventors

Portland, OR, United States of America

Bijoyraj Sahu