Asml Netherlands B.v.

Bijoy Rajasekharan

Roy Werkman

Jochem Sebastiaan Wildenberg

Marinus Jochemsen

Erik Jensen

Erik Johannes Maria Wallerbos

Cornelis Johannes Rijnierse

Jurgen Johannes Henderikus Maria Schoonus

Richard Johannes Franciscus Van Haren

Everhardus Cornelis Mos

Leon Paul Van Dijk

Sarathi Roy

David Frans Simon Deckers

Hadi Yagubizade

Victor Emanuel Calado

Xiuhong Wei

Lydia Marianna Vergaij-Huizer

Pieter Gerardus Jacobus Smorenberg

Robertus Wilhelmus Van Der Heijden

Adam Jan Urbanczyk

Ronald Van Ittersum

Ignacio Salvador Vazquez Rodarte

A method of determining a control parameter for a lithographic process is disclosed, the method includes: defining a substrate model for representing a process parameter fingerprint across a substrate, the substrate model being defined as a combination of basis functions including at least one basis function suitable for representing variation of the process parameter fingerprint between substrates and/or batches of substrates; receiving measurements of the process parameter across at least one substrate; calculating substrate model parameters using the measurements and the basis functions; and determining the control parameter based on the substrate model parameters and the similarity of the at least one basis function to a process parameter fingerprint variation between substrates and/or batches of substrates.

Methods and apparatus for controlling a lithographic process

A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.

Method for controlling a manufacturing apparatus and associated apparatuses

A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.

Optimizing a sequence of processes for manufacturing of product units

A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.

Method to change an etch parameter

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Eindhoven, Netherlands

Bijoy Rajasekharan