Visera Technologies Company Limited

Bii-Cheng Chang

Hsiao-Wen Lee

Fu-Tien Weng

Yi-Chuan Lo

Wu-Chieh Liu

Chin-Chen Kuo

Yung-Shun Liao

An exemplary wafer level package comprises a semiconductor wafer with a plurality of semiconductor chips of perfect polygonal shapes thereon. A circuit-free area is defined over the semiconductor wafer to electrically isolate the semiconductor chips. A dam structure is substantially formed over the circuit-free area, wherein a portion of the dam structure formed around an edge of the semiconductor wafer is formed with a plurality via holes therein. A transparent substrate is formed over the semiconductor wafer, defining a plurality of cavities between the semiconductor chips and the transparent substrate, wherein the transparent substrate is supported by the dam structure.

Wafer level package and mask for fabricating the same

The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

Imaging sensor having microlenses of different radii of curvature

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Hsinchu, Taiwan

Bii-Cheng Chang