Fairchild Semiconductor Corporation

Bigidis Dosdos

Daniel Marvin Kinzer

Steven Paul Sapp

Chung-Lin Wu

Oseob Jeon

In one general aspect, a system can include a through-silicon-via (TSV) coupling a drain region associated with a vertical transistor to a back metal disposed on a second side of the substrate opposite the first side. The system can include a first metal layer, and a second metal layer aligned orthogonal to the first metal layer. The system can define a conduction path extending substantially vertically through the TSV to the substrate and laterally through the substrate.

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Bigidis Dosdos