Dow Corning Corporation

Other

Dow Silicones Corporation

Bianxiao Zhong

Russell Keith King

Kyuha Chung

Shizhong Zhang

Donnie Ray Juen

Jonathan Hannington

Eric S Moyer

Nanguo Liu

Zuchen Lin

Martin E Cifuentes

Duane R Bujalski

Brian Harkness

Kai Su

Terry Clapp

William Neal Fenton

Zhongtao Li

Ronald Paul Boisvert

Mercedes Diaz

Tessa Johnson

A non-linear side chain liquid crystal polyorganosiloxane differs from previous side chain liquid crystal polyorganosiloxanes. A method for preparing the non-linear side chain liquid crystal polyorganosiloxane involves hydrosilylation reaction of a SiH rich intermediate with an aliphatically unsaturated mesogenic compound. A liquid crystal composition containing the non-linear side chain liquid crystal polyorganosiloxane is useful in dynamic scattering mode electro-optic device for various applications.

Non-linear side chain liquid crystal polyorganosiloxanes and methods for their preparation and use in electro-optic applications and devices

Various embodiments disclosed related to UV-curable silicone composition, cured products thereof, and methods of using the same. Various embodiments provide a shear-thinning UV-curable silicone composition. The composition can include (A) a mercapto-functional polyorganosiloxane having the unit formula [(CH)SiO][(CH)SiO][R(CH)SiO]wherein x is about 0.01 to about 0.1, y is about 0 to about 0.94, z is about 0.05 to about 0.99, and at each occurrence R is independently a mercapto(C)hydrocarbyl group. The composition can include (B) at least one of (B1) a polyorganosiloxane comprising at least two aliphatic unsaturated carbon-carbon bonds, and (B2) an organic molecule comprising at least two aliphatic unsaturated carbon-carbon bonds; the composition can include (C) a filler. The composition can also include (D) a photoinitiator.

UV-curable silicone composition, cured products thereof, and methods of using the same

A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.

Amide-substituted silicones and methods for their preparation and use

A siloxane resin having the formula: (HSiO)(RSiO)(SiO)where R is Z, Z(CH)or ZO(CH)where Z is a phenyl or substituted phenyl group; n has a value of 1 to 6, a has value of 0.01 to 0.7, b has a value of 0.05 to 0.7, c has a value of 0.1 to 0.9 and a+b+c&#x2248;1. The siloxane resins are useful in anti-reflective coating compositions.

Siloxane resin coating

Herein we disclose a composition, comprising a siloxane resin having the formula (HSiO). (SiO)(HSiX)(SiX), wherein each X is independently &#x2014;O&#x2014;, &#x2014;OH, or &#x2014;O&#x2014;(CH)&#x2014;Z, wherein each m is independently an integer from 1 to about 5, Z is an 5 aromatic moiety, and each n is independently an integer from 1 to about 6; 0&#x3c;a&#x3c;1, 0&#x3c;b&#x3c;1, 0&#x3c;c&#x3c;1, 0&#x3c;d&#x3c;1, and a+b+c+d=1. We also disclose methods for preparing the siloxane resin composition and a method of preparing an anti-reflective coating on a substrate, wherein the anti-reflective coating is derived from the siloxane resin composition.

Siloxane resin-based anti-reflective coating composition having high wet etch rate

Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO ) (R&prime;SiO ) , wherein R is selected from the group consisting of C -C alkyl, C -C alkenyl, C -C alkoxy, C -C alkenoxy, and C -C substituted hydrocarbon; R&prime; is selected from the group consisting of &mdash;H, C -C unsubstituted hydrocarbon, and C -C substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x&plus;y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO . Also disclosed herein is a method of preparing such a resin solution, as well as a method of preparing a solid coating, comprising (i) coating the resin solution on a surface; (ii) removing the solvent from the resin solution; (iii) removing R groups from the organosiloxane resin; and (iv) curing the resin solution, to form the solid coating. Coatings prepared from the resins disclosed herein have relatively low dielectric constants and also have relatively low SiH content and relatively high modulus.

Hydrosilsesquioxane resin compositions having improved thin film properties

Silicone resins having the general formula (R SiO ) (HSiO ) where R is an alkyl group having 8 to 24 carbon atoms; x has a value of 0.05 to 0.7; y has a value of 0.3 to 0.95 and x&plus;y &equals;1. The resins are used to form porous ceramic materials and porous thin films on semiconductor devices.

Silicone resins and porous materials produced therefrom

Nanoporous silicone resins having low dielectric constants

An alkoxyhydridosiloxane resin composition comprising ROSiO siloxane units and HSiO siloxane units wherein R is an alkyl group having 10 to 28 carbon atoms, wherein the alkoxyhydridosiloxane resin contains an average from 5 to 40 mole percent silicon bonded alkoxy groups, and wherein the alkoxyhydridosiloxane resin contains an average of at least 45 mole percent silicon bonded hydrogen atoms. While not represented by the structure, the resins may also contain a small number of atoms which have either 0 or 2 hydrogen atoms attached thereto and/or a small number of SiC groups such as CH SiO or HCH SiO groups. These resins are useful for forming nanoporous silicone resin coatings having low dielectric constant coatings useful for electrical insulating coatings on electronic devices.

Alkoxyhydridosiloxane resins

Silicone resin compositions having good solution solubility and stability

Nanoporous silicone resins having low dielectric constants and method for preparation

Soluble silicone resin compositions having good solution stability

The present invention relates to a foam control composition and to its use in foaming systems. More particularly, this invention relates to a foam control composition comprising a polysiloxane and a resin-filler made from MQ resins having at least one polyoxyalkylene group. The compositions of this invention exhibit excellent defoam effects and antifoam persistency.

Foam control compositions having resin-fillers

A method for preparing a microporous silicone resin which can be used to form low dielectric constant films useful for electrical insulating coatings on electronic devices comprising (A) contacting a hydridosilicon containing resin with an alkenyltriarylsilane in the presence of a platinum group metal-containing hydrosilation catalyst effecting formation of a silicon resin where at least 5 percent of silicon atoms are substituted with at least one triarylsilylalkylene group and at least 45 percent of silicon atoms are substituted with at least one hydrogen atom and (B) heating the silicon resin of step (A) in an inert atmosphere at a temperature sufficient to effect thermolysis of the triarylsilylalkylene groups from the silicon atoms.

Method for making microporous silicone resins with narrow pore-size distributions

A method for preparing a nanoporous silicone resin which can be used to form low dielectric constant films useful for electrical insulating coatings on electronic devices comprising (A) contacting a hydridosilicon containing resin with a 1-alkene comprising about 8 to 28 carbon atoms in the presence of a platinum group metal-containing hydrosilation catalyst effecting formation of an alkylhydridosiloxane resin where at least 5 percent of silicon atoms are substituted with at least one group comprising about 8 to 28 carbon atoms and at least 45 percent of silicon atoms are substituted with at least one hydrogen atom and (B) heating the alkylhydridosiloxane resin of step (A) at a temperature sufficient to effect curing and thermolysis of alkyl groups comprising about 8 to 28 carbon atoms from the silicon atoms thereby forming a nanoporous silicone resin.

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Midland, MI, United States of America

Bianxiao Zhong