Xi'an Jiaotong University

Bian Tian

Zhuangde Jiang

Libo Zhao

Zhongkai Zhang

Jiangjiang Liu

Zhaojun Liu

Le Li

Yan Zhao Liu

Shuimin Li

Jiaming Lei

Songli Wang

Nan Zhu

Junxia Wu

Xudong Fang

Ziyan Fang

Chen Wu

Wubin Deng

Bonan Gao

Bingfei Zhang

Qijing Lin

Peng Shi

Cunfeng Wang

An alginate hydrogel-based thin-film heat flux sensor for billet crystallizer includes an alginate hydrogel substrate. The alginate hydrogel substrate is configured in a U-shaped planar structure. The U-shaped planar structure includes a first side and a second side, and the first side is longer than the second side. An inner surface of the alginate hydrogel substrate is provided with a first film thermocouple and a second film thermocouple. The first film thermocouple is in crosslinking connection with the second film thermocouple.

Alginate hydrogel-based thin-film heat flux sensor for billet crystallizer

A silicon carbide-based micro-electro-mechanical system (MEMS) combined temperature-pressure sensor chip and a preparation thereof. The chip includes a peripheric pressure-measuring unit and a center temperature-measuring unit. The pressure-measuring unit includes a silicon carbide substrate with a raised island and a pressure sensitive diaphragm formed by etching the back of the substrate. The raised island and the pressure-sensitive diaphragm constitute a membrane-island structure. Four piezoresistive strips are arranged symmetrically along a circumferential direction of a root of the pressure-sensitive diaphragm and between the raised island and the pressure-sensitive diaphragm. The temperature-measuring unit includes the raised island and a thin-film thermocouple arranged thereon.

Silicon carbide-based combined temperature-pressure micro-electro-mechanical system (MEMS) sensor chip and preparation method thereof

Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.

Tungsten-rhenium composite thin film thermocouple based on surface micropillar array with gas holes

A thin-film thermocouple probe includes a columnar substrate, a tungsten-26% rhenium film and an indium oxide (InO) film. A side surface of the columnar substrate is provided with a first straight groove and a second straight groove. The tungsten-26% rhenium film is arranged on a front end surface of the columnar substrate and in the first straight groove. The indium oxide film is arranged on the front end surface of the columnar substrate and in the second straight groove. The indium oxide film on the front end surface of the columnar substrate is connected to the tungsten-26% rhenium film on the front end surface of the columnar substrate. A first metal lead wire is connected to the tungsten-26% rhenium film, and a second metal lead wire is connected to the indium oxide film. A method of preparing the thin-film thermocouple probe is provided.

Thin-film thermocouple probe and method of preparing same

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