Innolux Corporation

Bi-Ly Lin

Chia-Chun Yang

Wen-Cheng Huang

Chien-Wei Tseng

Ying-Jung Wu

Yeong-E Chen

Chih-Chung Hsu

Chung-Jun Kuo

Hsing-Chien Tuan

Rong-Jyun Lin

I-Wen Yang

Kuang Chiang Huang

Yu Ting Liu

Ying- Jung Wu

An electronic device including an active region and a peripheral region, and includes a substrate including a first edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue disposed in the peripheral region and overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue extends along an extension direction parallel to the first edge, and along the extension direction, a sum of lengths of the first conductive glue and the second conductive glue is less than a length of the insulating glue.

Electronic device

The embodiments of the disclosure provide a manufacturing method of a package circuit, including the following steps. A circuit structure including a plurality of conductive pads is formed. A liquid crystal layer is formed on the circuit structure. An inspection step is performed, and the inspection step includes determining the conductivity of the conductive pads according to the result of the rotation of a liquid crystal layer oriented with an electric field. In addition, the liquid crystal layer is removed.

Manufacturing method of package circuit

A tiled light transmitting controller includes a first panel, a second panel, a first cover plate and a second cover plate. The second panel is electrically connected to the first panel. The second cover plate is arranged to be opposite to the first cover plate. The first panel and the second panel are arranged between the first cover plate and the second cover plate.

Tiled light transmitting controller

An electronic device includes a solar cell, a first light modulating layer, a transmittance-adjustable lens and a control circuit. At least a portion of the first light modulating layer is disposed on the solar cell. The control circuit is electrically connected to the solar cell and the transmittance-adjustable lens.

An electronic device including an active region and a peripheral region, and includes a substrate including a first edge and a second edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue is disposed in the peripheral region and extends along an extension direction parallel to the first edge, and along the extension direction, a first distance between the first conductive glue and the second edge is greater than a second distance between the second conductive glue and the second edge.

An electronic device includes: a first light modulation assembly, including: a first substrate; a second substrate opposite to the first substrate; a first conductive layer disposed on the first substrate; a second conductive layer disposed on the second substrate; a first insulating layer disposed on the first substrate; and a first light modulation layer disposed between the first conductive layer and the second conductive layer.

An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.

An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a second electrode layer disposed on the second substrate; a display medium layer disposed between the first electrode layer and the second electrode layer; a sealant disposed between the first electrode layer and the second electrode layer to surround the display medium layer; and a first metal element extending along a first direction, wherein the first metal element is fixed onto the first electrode layer through a conductive glue and a first insulating glue.

Electronic device and method for manufacturing the same

A thin film transistor substrate is provided. The thin film transistor substrate includes a substrate; at least one signal line disposed over the substrate; a repair line disposed over the signal line and electrically connected to the signal line; and a light-shielding layer disposed over the repair line, wherein the light-shielding layer covers the repair line, and an area of the light-shielding layer is greater than that of the repair line.

Thin film transistor substrate

An embodiment of a liquid-crystal display is provided, including: a display area; and a shielding area surrounding the display area, wherein the shielding area includes: a light-shielding layer adjacent to a side of the display area; and a sealant dispensing area adjacent to a side of the light-shielding layer opposite to the display area, wherein the shielding area has a total light transmittance of less than or substantially equal to that of the shielding layer.

Growing community of inventors

Miao-Li County, Taiwan

Bi-Ly Lin