Qualcomm Incorporated

Qualcomm Technologies, Inc.

Bhushan Shanti Asuri

Gurkanwal Singh Sahota

Jeremy Darren Dunworth

Chuan Wang

Vinod Panikkath

Ibrahim Ramez Chamas

Li Liu

Chinmaya Mishra

Krishnaswamy Thiagarajan

Muhammad Hassan

Ayush Mittal

Shrenik Patel

Ravi Sridhara

Hongyan Yan

Abdellatif Bellaouar

Kevin Hsi-Huai Wang

Mohamed Abouzied

Janakiram Ganesh Sankaranarayanan

Omar Essam El-Aassar

Dongwon Seo

Shahin Mehdizad Taleie

Behnam Sedighi

Himanshu Khatri

Arul Balasubramaniyan

Jorge Garcia

Chirag Dipak Patel

Aristotele Hadjichristos

Lai Kan Leung

Jeremy Mark Goldblatt

Rajagopalan Rangarajan

Gary John Ballantyne

Sang-June Park

Prasad Srinivasa Siva Gudem

Jifeng Geng

Kevin Hsi Huai Wang

Junxiong Deng

Nitz Saputra

Mahim Ranjan

Maulin Pareshbhai Bhagat

Sameer Vasantlal Vora

Mohammad Farazian

Yung-Chung Lo

Gary J Ballantyne

Laya Mohammadi

Hyejeong Song

Sahar Nozari

Gajanan Maroti Devpuje

Liang Zhao

Mihir Vijay Laghate

Chiewcharn Narathong

Gireesh Rajendran

Yiwu Tang

Aleksandar Miodrag Tasic

Frederic Bossu

Jingcheng Zhuang

Babak Nejati

Prasad S Gudem

Zhang Jin

Dongling Pan

Ashok Swaminathan

Kang Yang

I-Hsiang Lin

Thomas Domenick Marra

Yunfei Feng

Alok Prakash Joshi

Thomas Myers

Soon-Seng Lau

Anosh Bomi Davierwalla

Yu Zhao

Jong Min Park

Guy Klemens

Vijay Chellappa

Wingching Vincent Leung

Dongjiang Qiao

Revathi Sundara Raghavan

Ockgoo Lee

Zhilong Tang

Marco Vigilante

Parisa Mahmoudidaryan

Damin Cao

Francesco Carrara

Haigang Feng

Ping Wing Lai

Youngchang Yoon

Zhijie Xiong

Anushruti Bhattacharya

Tonmoy Biswas

Sreenivasa Mallia

Apsara Ravish Suvarna

Osama Elhadidy

Arpit Gupta

Chen Jiang

Maziar Hedayati

Norman L Frederick

Praveen Sampath

Yen-Wei Chang

Sy-Chyuan Hwu

Vinod V Panikkath

Maulin Bhagat

A transceiver interface for a phased array element includes a first magnetic circuit having a primary coil and a secondary coil, a second magnetic circuit having a primary coil, a secondary coil and a tertiary coil, a main amplifier path and an auxiliary amplifier path, the main amplifier path coupled to the primary coil of the second magnetic circuit and configured to receive a quadrature signal, the main amplifier path configured to provide a quadrature output signal, the auxiliary amplifier path coupled to the primary coil of the first magnetic circuit and configured to receive an in-phase signal, the auxiliary amplifier path configured to provide an in-phase output signal, a selectable output circuit configured to selectively combine the in-phase output signal and the quadrature output signal, and a low noise amplifier (LNA) coupled to the tertiary coil of the second magnetic circuit.

Doherty transceiver interface

A peak detector for a power amplifier is provided that includes a threshold voltage detector configured to pulse a detection current in response to an amplified output signal from the amplifier exceeding a peak threshold. A plurality of such peak detectors may be integrated with a corresponding plurality of power amplifiers in a transmitter. Should any peak detector assert an alarm signal or more than a threshold number of alarm signals during a given period, a controller reduces a gain for the plurality of power amplifiers.

Amplifier peak detection

A load line impedance modulation circuit includes a magnetic circuit, an adjustable capacitance coupled to an output of the magnetic circuit, and a plurality of adjustable resistances coupled to the output of the magnetic circuit, wherein the plurality of adjustable resistances are configured to select from available output ports, an impedance presented by the load line impedance modulation circuit being adjustable dependent on at least a number of selected output ports.

Multi-mode multi-port driver for transceiver interface

In certain aspects, a method is provided for measuring power using a resistive element coupled between a power amplifier and an antenna. The method includes squaring a voltage from a first terminal of the resistive element to obtain a first signal, squaring a voltage from a second terminal of the resistive element to obtain a second signal, and generating a measurement signal based on a difference between the first signal and the second signal. In some implementations, the resistive element is implemented with a power switch.

Power detector

In certain aspects, a chip includes a pad, and a power amplifier having a first output and a second output. The chip also includes a transformer, wherein the transformer includes a first inductor coupled between a first terminal and a second terminal of the transformer, wherein the first terminal is coupled to the first output of the power amplifier, and the second terminal is coupled to the second output of the power amplifier. The transformer also includes a second inductor coupled between a third terminal and a fourth terminal of the transformer, wherein the third terminal is coupled to the pad. The chip also includes a first switch coupled to the fourth terminal, a shunt inductor coupled in parallel with the first switch, and a low-noise amplifier coupled to the third terminal.

Switch with electrostatic discharge (ESD) protection

A transceiver interface circuit, comprising a driver amplifier (DA), a load line impedance modulation circuit coupled to the DA; and multiple selectable output ports coupled to the load line impedance modulation circuit, an impedance presented by the load line impedance modulation circuit being adjustable dependent on at least a number of output ports coupled to the load line impedance modulation circuit.

Designs and techniques for manufacturing microelectronic antenna tuners are provided. An example microelectronic antenna system includes a radio frequency integrated circuit comprising a plurality of radio frequency signal ports disposed in a first area, a plurality of tuning devices disposed in a second area of the radio frequency integrated circuit, at least one antenna element disposed on a substrate coupled to the radio frequency integrated circuit, and at least one feedline disposed in the substrate and configured to communicatively couple the at least one antenna element, at least one of the plurality of tuning devices, and one of the plurality of radio frequency signal ports.

Millimeter wave antenna tuner

An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.

High-density flip chip package for wireless transceivers

A method of wireless communication includes receiving a first beam using a first antenna device during an occasion of a reference signal. The method further includes receiving a second beam using a second antenna device that is distinct from the first antenna device during the occasion of the reference signal. Receiving the first beam and the second beam includes inputting, to a modem, a representation of a combination of the first beam and the second beam. Receiving the first beam and the second beam further includes generating, by the modem based on the representation, a first signal associated with the first beam using a first parameter associated with the first antenna device and a second signal associated with the second beam using a second parameter associated with the second antenna device.

Receiver for processing multiple beams at a user equipment (UE) device

In certain aspects, a method includes receiving a first intermediate frequency (IF) signal and a second IF signal via a common input, upconverting the first IF signal into a first radio frequency (RF) signal, transmitting the first RF signal via a first antenna array, upconverting the second IF signal into a second RF signal, and transmitting the second RF signal via a second antenna array. In a first transit mode, the first RF signal is in a first frequency band and the second RF signal is in a second frequency band, and, in a second transmit mode, the first RF signal and the second RF signal are both in the first frequency band.

Multi-band transmitter

Aspects of the present relate to reflection type phase shifters for radio frequency (RF) wireless devices. Reflection type phase structures in accordance with aspects described herein can improve device performance with compact configurations, such as where magnetic and capacitive coupling is integrated into a device design to integrate interactions between elements for improved phase shifting performance in a compact design with wideband performance.

Compact low-loss reflection type phase shifter

Certain aspects of the present disclosure provide an amplifier. The amplifier generally includes an amplifier core circuit configured to amplify a radio frequency signal and having a first output and a second output; a transformer coupled to the amplifier core circuit, the transformer having a primary winding and a secondary winding, the primary winding being coupled to the first output and the second output of the amplifier core circuit, the secondary winding being coupled to an output node of the amplifier; and a variable resistance circuit coupled in parallel with the primary winding.

Wideband amplifier

Power detector including squaring circuits

According to certain aspects, a chip includes a pad, a power amplifier, a transformer coupled between an output of the power amplifier and the pad, a transistor coupled between the transformer and a ground, and a first clamp circuit coupled between a gate of the transistor and a drain of the transistor.

In certain aspects, an apparatus includes a power detector coupled between a power amplifier and an antenna, and a voltage detector coupled between the power amplifier and the antenna. The apparatus also includes a phase shifter coupled to the power detector, and a load measurement circuit coupled to the power detector, the voltage detector, and the phase shifter.

Apparatus and method to determine impedance and/or admittance in a wireless device

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San Diego, CA, United States of America

Bhushan Shanti Asuri