Dow Global Technolgoies LLC

Dow Silicones Corporation

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Bhawesh Kumar

Maurice J Marks

George C Jacob

Timothy J Young

Christophe R Laroche

Lauren Marie Tonge

Manesh Nadupparambil Sekharan

Gyongyi Gulyas

Mohammad T Islam

Nan-Rong Chiou

Brian Jeffery Swanton

Rainer Koeniger

Mark W Brown, Ii

Tzu-Chi Kuo

Wenjun Xu

Adam H Broderick

Nebjosa Jelic

Rujul M Mehta

Jonathan G Weis

Sarah E Mastroianni

Ni Yan

Martin Reimers

Mark Brown Ii

Mark W Brown

Timothy A Morley

A bonded multilayer article including: (a) at least one first layer of a silicone-containing rubber substrate material bonded to (b) at least one second layer of a substrate material bondable to the first layer; wherein at least a portion of the surface of the first layer is activated for adhesion to increase the bond strength of the first layer to a second layer such that the bond strength of the first layer bonded to the second layer is increased; and a process for producing the above bonded multilayer article.

Bonded multilayer article

A polypropylene/thermoplastic vulcanizate insulative coating is disclosed. The coating is particularly suited for subsea applications, in particular providing insulation to joints in oil well pipes and other machinery. The coating exhibits mechanical properties superior to joint insulation coatings known in the art, especially in combination with other insulation coatings.

Thermoplastic vulcanizates modified polypropylene for subsea insulation

The present invention relates to a method of coating a pipeline field joint comprising the steps of (a) applying a layer of a coating material composition comprising (i) a propylene polymer and (ii) a substantially linear ethylene copolymer, a linear ethylene copolymer, or mixtures thereof, to the uncoated region of the field joint, preferably the coating is applied by injection molding.

Method for coating a pipeline field joint

The present invention provides aqueous, epoxy-based sizing compositions for carbon fibers. The size composition incorporates highly functionalized film forming epoxy novolac phenolic resins in combination with highly functionalized sulfonated polyesters having high Tg characteristics, sulfonate equivalent weights in the range from 2000 to 20,000 and number average molecular weights in the range from about 1000 to about 100,000. The present invention also provides corresponding sized carbon fibers and fiber-reinforced matrices.

Sizing compositions for carbon fibers

A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising a curative and a polyisocyanate prepolymer having an unreacted isocyanate (NCO) concentration of from 8.3 to 9.8 wt. % and formed from a polyol blend of polypropylene glycol (PPG) and polytetramethylene ether glycol (PTMEG) and containing a hydrophilic portion of polyethylene glycol or ethylene oxide repeat units, a toluene diisocyanate, and one or more isocyanate extenders, wherein the polyurethane reaction product exhibits a wet Shore D hardness of from 10 to 20% less than the Shore D hardness of the dry polyurethane reaction product.

High planarization efficiency chemical mechanical polishing pads and methods of making

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Lake Jackson, TX, United States of America

Bhawesh Kumar