Hewlett-packard Development Company, L.p.

Bhavin Shah

Garrett E Clark

Anthony M Fuller

Bradley D Chung

Ozgur E Yildirim

A heating element of a fluid ejection device includes an insulative layer, a resistor portion interposed between and spaced apart from a pair of conductive portions, and an upper structure defining a fluid chamber above the resistor portion. The insulative layer defines a shoulder portion adjacent a side edge of the resistor portion, the shoulder portion vertically spaced below a top surface of the resistor portion by a distance of no more than twice a thickness of the resistor portion.

Heating element

Embodiments of a heating element of a fluid ejection device are disclosed.

A method of making a printhead comprises forming a resistor strip in a heating region of the printhead. In a first portion of the heating region, a resistive layer is formed including a central resistor region interposed between two spaced apart conductive elements. In the method, a conductive layer is removed from a bus region of the printhead while protecting the first portion of the heating region.

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Corvallis, OR, United States of America

Bhavin Shah