3M Innovative Properties Company

Other

Minnesota Mining and Manufacturing Company

University of California

Solventum Intellectual Properties Company

Bhaskar V Velamakanni

Sumita Basu Mitra

Alphonsus V Pocius

John J Stofko, Jr

Jeremy M Yarwood

Richard J Webb

Mark Serafin

Joel D Oxman

Daniel J Skamser

Mario Alberto Perez

Matthew S Stay

David K Cinader, Jr

Richard Paul Rusin

Yizhong Wang

Jie Yang

Todd D Jones

Frederick F Lange

Christopher John Rueb

Richard Dale Olmsted

Zvi Rogovin

Richard M Fuller

Holger Hauptmann

Kevin W Gotrik

Gaddam N Babu

Greggory S Bennett

Afshin Falsafi

Helmar B Mayr

Richard Yufeng Liu

Scott J Jones

Joan V Brennan

Matthew R D Smith

Mark E Napierala

David J Rowe

Eric Joseph Hanson

Tiffany T Ton

Huiwen Tai

Michael L Tumey

Matthew E Sousa

Louis E Winslow

Lyudmila A Pekurovsky

Bradley L Givot

Paul R Klaiber

David Robert Mekala

Nathaniel I Lehn

Robert R Owings

Kevin T Reddy

Paul Hattam

Joan M Frankel

Anthony G Evans

James K Young

Jeanne M Bruss

Jennifer J Post

Nathan K Hagen

Chad D Mistele

Mitchell A Hirsch

David R Hague

Robert Mehrabian

David C Lam

Anupa N Patel

John J Stofko

A dental appliance for positioning a patient's teeth includes a polymeric shell with a plurality of cavities for receiving one or more teeth. The polymeric shell includes at least 3 alternating polymeric layers AB, wherein layer A includes a thermoplastic polymer A, layer B includes a thermoplastic polymer B, and the thermoplastic polymer B is different from the thermoplastic polymer A. Each of the thermoplastic polymers A and B have a flexural modulus of about 1.0 GPa to about 4.0 GPa; and each of the thermoplastic polymers A and B have a glass transition temperature (T) greater than about 40° C.

Multi-layered dental appliance

A transfer article with a thickness of less than 3 micrometers includes a first acrylate layer that is releasable from a metal or doped semiconductor release layer at a release value of from 2 to 50 grams/inch. The article includes a functional layer overlaying the first acrylate layer. The functional layer includes at least one microfractured inorganic layer about 3 nanometers to about 200 nanometers thick, which has a plurality of toolmarks interspersed with cracks.

Patterned transfer articles

A dental article includes a shell defining a volume, the shell including a circumferential base and an incisal/occlusal region distal from the circumferential base. A hardenable dental composition is located within the volume of the shell, and an isolation film is located at the circumferential base of the shell.

Dental articles and methods of using same

Methods of using a dental composition having a photobleachable dye and an acidic component with a pKa of less than 4.5 are disclosed. The photobleachable dye is selected from the group consisting of aminoanthraquinone dyes, azo dyes, and combinations thereof. The aged color of the dental composition is substantially the same as the color of the dental composition immediately after hardening.

Methods of using a dental composition having an acidic component and a photobleachable dye

Provided are methods of improving the wear resistance and aesthetic properties of dental articles though use of spherical microparticles, as well as dental articles having an abrasion resistant spherical microparticle/polymer coating thereon.

Aesthetic and abrasion resistant coated dental articles and methods of making the same

Provided are methods of improving the wear resistance and aesthetic properties of dental articles though use of ceramics and microparticles, as well as dental articles having an abrasion resistant microparticle and ceramic coating thereon.

Dental articles including a ceramic and microparticle coating and method of making the same

Dental compositions are provided comprising a compound of Formula (I) or a pharmaceutically acceptable salt thereof: wherein n is an integer from about 2 to about 5. 

Therapeutic dental composition and related methods

Dental compositions are provided comprising a compound of Formula I or a pharmaceutically acceptable salt thereof: wherein n is an integer from about 2 to about 5.

Film forming dental compositions comprising a compound of formula (I) or a pharmaceutically acceptable salt thereof, and a binder. The film forming dental compositions can include an amino sugar, a derivative of an amino sugar, or a pharmaceutically acceptable salt thereof, and can be useful in inhibiting biofilm formation in an oral cavity.

Film forming dental compositions and related methods

A catalyst ink is provided, comprising: 25-95% by weight water; 1-50% by weight of at least one solid catalyst, typically a highly dispersed platinum catalyst; 1-50% by weight of at least one polymer electrolyte in acid (H) form; and 1-50% by weight of at least one polar aprotic organic solvent. The catalyst ink typically has a viscosity at 1 secof 10 Pa&#xb7;sec or less. The catalyst ink typically does not ignite spontaneously when dried to completion in air at a temperature of 80&#xb0; C. or greater. The catalyst ink may be used in the fabrication of membrane electrode assemblies for use in fuel cells.

Catalyst ink

The present invention relates to a filler material useful for communication cables, such as electrical cables and optical cables. In one embodiment, (a) from about 50 to 95 percent by weight mineral oil; (b) less than about 10 percent by weight block copolymer selected from the group consisting of styrene-ethylene/butylene, styrene-ethylene/propylene, styrene-butadiene-styrene, styrene-isoprene-styrene, styrene-ethylene/butylene-styrene, styrene-ethylene/propylene-styrene, and combinations thereof; (c) less than about 35 percent by weight petroleum wax; (d) less than about 20 percent by weight hollow glass microspheres; and (e) less than about 10 percent by weight thixotropic agent selected from the group consisting of clay, colloidal metal oxide, fumed metal oxide, and combinations thereof.

Filling materials

A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

Wafer planarization composition and method of use

A process and a high pressure apparatus are disclosed which are useful in preparing magnetic dispersions and other dispersions of hard, non-compliant particulates. The apparatus can be monitored for clogs and wear and allows for relatively quick and inexpensive replacement of orifices. The apparatus includes a high pressure pump and a series of impingement chambers comprising an input manifold where the process stream is split into two or more streams and an output manifold where the streams are recombined after passing through restrictive orifices configured in such a manner that the streams impinge on each other at high velocities. The orifices in each succeeding impingement zone are the same size or smaller than the orifices in the preceding impingement zone, and the orifices in the final impingement zone must be smaller than the orifices in the first impingement zone.

Process for preparing a dispersion of hard particles in solvent

Growing community of inventors

Woodbury, MN, United States of America

Bhaskar V Velamakanni