New Mexico Tech University Research Park Corporation

Bhaskar S Majumdar

Luke Soule

Sherin Bhassyvasantha

The disclosure provides a Sn—In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn—In alloy film on a Cu substrate effectively mitigates whisker growth.

Tin-indium alloy electroplating solution

The disclosure provides a Sn&#x2014;In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn&#x2014;In alloy film on a Cu substrate effectively mitigates whisker growth.

Growing community of inventors

Socorro, NM, United States of America

Bhaskar S Majumdar