Motorola Corporation

Freescale Semiconductor,inc.

Bharathi Ranjit Singh

William R Williams

Peter B Gilmore

Weng Kong Hor

Donald F Gatto

Kathirawan Santhinan

Azmi Rashid

A test equipment manifold interface for automated test equipment (ATE) for testing electronic circuits by both Device Under Test Thermal Management (DTM) and non-DTM testing. The manifold interface has a housing, with an air inlet aperture, outlet apertures, and a chamber. The chamber has a chamber inlet provided by the air inlet aperture and a chamber outlet coupled to the outlet apertures. A hollow piston is captive in the chamber. The piston has DTM interface inlet and outlet apertures. In operation, when a DTM load board manifold engages the manifold interface, the hollow piston directs air to flow from the air inlet aperture to the DTM interface outlet aperture. When the DTM load board manifold disengages the manifold interface, the hollow piston directs air to flow from the air inlet to the outlet apertures via the chamber outlet.

Test equipment manifold interface

An accessory connector () and a method () for providing a robust submersible seal is provided. The method can include over molding () a high-temperature plastic () around a plurality of interconnect pins () to produce a header (), over molding () a low-temperature plastic () to the header to produce an insert (), over molding () a side connector assembly () along a periphery of the insert to produce an interface (), and ultrasonically welding () the insert to a housing () to blend () the low-temperature plastic with the housing.

Submersible accessory connector

Growing community of inventors

Petaling Jaya, Malaysia

Bharathi Ranjit Singh