Microsoft Technology Licensing, LLC

Bharath Ramakrishnan

Husam Atallah Alissa

Ioannis Manousakis

Eric Clarence Peterson

Nicholas Andrew Keehn

Christian L Belady

Vaidehi Oruganti

Ricardo Gouvea Bianchini

Sean Michael James

Dennis Trieu

Douglas Patrick Kelley

Marcus Felipe Fontoura

Mark Alan Monroe

Stephan W Gilges

Kathryn M Oseen-senda

Seth Henderson Morris

Mark Edward Shaw

Brandon Aaron Rubenstein

Ruslan Nagimov

Robert Jason Lankston

Alexis Grace Schubert

Stephan Wayne Gilges

A thermal management device includes a body, a fluid movement structure, and a movement mechanism. The body is configured to receive heat from a heat-generating component at a proximal surface, and the fluid movement structure is on a distal surface of the body that is distal to the proximal surface, wherein the fluid movement structure is configured to direct fluid flow of a working fluid and the body is configured to transfer heat to the working fluid. The movement mechanism is configured to move the fluid movement structure relative to the body.

Systems and methods for thermal management of electronic devices

A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.

Systems and methods for immersion-cooled datacenters

An immersion cooling system includes an immersion tank that is configured to retain dielectric working fluid and to hold a plurality of computing devices submerged in the dielectric working fluid. The immersion cooling system also includes a condenser that is configured to cause condensation of vaporized working fluid. The immersion cooling system also includes a subcooling heat exchanger that is in fluid communication with a coolant source. The coolant source provides coolant having a coolant temperature that is lower than a boiling point of the dielectric working fluid. The subcooling heat exchanger is positioned so that heat transfer can occur between the dielectric working fluid and the subcooling heat exchanger. The immersion cooling system also includes a control system that controls how much of the coolant flows into the subcooling heat exchanger based at least in part on a temperature of the dielectric working fluid.

Immersion cooling system that enables increased heat flux at heat-generating components of computing devices

The discussion relates to cooling computing devices and specifically to managing two-phase cooling. One example can include a two-phase liquid immersion tank containing heat generating components and a liquid phase of a coolant having a boiling point within an operating temperature range of the heat generating components. The example can also include a stratification chamber fluidly coupled to the liquid immersion tank and configured to at least partially separate a gas phase of the coolant from other gases. The example can further include a condenser chamber fluidly coupled to the stratification chamber and configured to receive the gas phase of the coolant and cause the gas phase of the coolant to phase change back into the liquid phase of the coolant.

Two phase coolant management

A carbon capture system includes two carbon capture plates. A first carbon capture plate collects carbon dioxide from a flow of ambient air. A second carbon capture plate releases carbon dioxide upon application of heat from a heat exchanger. The heat is exhaust heat from a data center. The first carbon capture plate and the second carbon capture plate are rotatable between the capture and release positions. The carbon capture system uses the waste heat from a data center to collect and store atmospheric carbon dioxide, thereby reducing the concentration of atmospheric carbon dioxide.

Carbon capture system

An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.

Liquid powered and cooled microfluidics photonics architecture

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

Ultra dense processors with embedded microfluidic cooling

A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

3-D structured two-phase microfluidic cooling with nano structured boiling enhancement coating

Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container. This container is operable to maintain different pressure levels. The pressurized cooling system includes a pressure system structured to modify a pressure within the container. The system operates in a first state when the pressure is above a threshold pressure. The system operates in a second state when the pressure is at the threshold pressure. The system operates in either one of the first state or the second state based on an operating state of the heat generating component.

Pressure based phase immersion cooling system

A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

3-D structured two-phase cooling boilers with nano structured boiling enhancement coating

A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Systems and methods for thermal management of high-capacity devices in immersion-cooled datacenters

Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.

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Bellevue, WA, United States of America

Bharath Ramakrishnan