Henkel Kommanditgesellschaft Auf Aktien

Henkel Ag & Company, Kgaa

Bettina Becker

Reimar Heucher

Juergen Wichelhaus

Angela Rossini

Thomas Moeller

Thomas Huver

Siegfried Kopannia

Luca Mario Marchese

Ingolf Scheffler

Tina Nataniel

Georg Schubert

Kurt Schueller

Andrea Hoffmann

Liane Meuten

Andre Kluth

Josef Giesinger

André Kluth

Rüdiger Butterbach

Fabio Ticozzelli

Heinrich Dwight

The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus particularly suited for applications where such properties are desirable, such as ventilation and air-conditioning systems and air filters. The invention further relates to the use of said hot melt adhesives in such ventilation and air-conditioning systems and air filters as well as for bonding, stabilizing and sealing of pleats, edge and frame bonding, or seam sealing of bag filters. Further encompassed are air filters comprising the hot melt adhesives and methods of their manufacture using the hot melt adhesives of the invention.

Hot melt adhesive comprising isothiazolinone fungicides

Polyamide hot-melt adhesives based on the reaction products of polymeric fatty acids, C-Cmonocarboxylic acids, C-Cdicarboxylic acids and diamines which do not contain any water-extractable, environmentally toxic constituents, which are suitable for sealing cavities in soils, in rock formations, building structures and/or walls, in particular for sealing tunnels, galleries, shafts, channels or caverns, to protect against the penetration of water or the penetration of liquids or gases which contain hazardous substances.

Melt-adhesives for sealing off rocks or building materials

Polyamides based on reaction products of C-Cdicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Method for forming moldings from dimer fatty acid free polyamides

Polyamide based on dimer fatty acid

Plug-type connector for coaxial cables

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Monheim, Germany

Bettina Becker