Siemens Aktiengesellschaft

Bertrand Viala

Markus Meier

Stephan Jonas

Walter Apfelbacher

Jürgen Trottmann

Arndt-Peter Wolf

A semiconductor switching module including a housing having openings to remove pressure which occurs during a short circuit. The housing openings, which can be sealed by thin walls dimensioned so that so that parts which carry current cannot be touched from outside and the walls can be destroyed or removed by the pressure which occurs during a short circuit.

Semiconductor switching module optimized for resistance to short circuits

A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the substrate in thermal contact with the base plate, has a central pressure bolt adjoined by a plurality of stamps which extend in different directions and are intended to contact-connect the substrate, the individual stamps being at non-uniform distances from the substrate in the mechanically unloaded state of the pressure bolt.

Power semiconductor module

Semiconductor based switching device

An electromechanical switching device of at least one embodiment includes fixed contacts securely arranged in a housing and a moving contact bridge for bridging the fixed contacts, a moving contact carrier to carry the contact bridge, and a solenoid to act on the contact carrier. In at least one embodiment the solenoid includes a coil body fixed to the housing, an armature coupled to the contact carrier so as to move with it, a yoke to act together with the armature, and a fixing mechanism, which engages with the yoke and coil body for fixing the yoke to the coil body.

Growing community of inventors

Karlsruhe, Germany

Bertrand Viala