Kla Tencor Corporation

Kla Corporation

Bert Vangilbergen

Carl Truyens

Erik De Block

Bruno Accou

Jimmy Vermeulen

Karel Van Gils

Foon Ming Chan

Maarten Brocatus

Kw Cheung

Harry Paredaens

Kc Leung

A method of inspection or metrology of four sides of a sample is disclosed. The method includes providing samples in a carrier at a first side of an imaging tool and moving the samples from the carrier to the imaging tool via a pick-and-place stage assembly. The method includes imaging first and second sides of the samples via first and second channels of the imaging tool and returning the samples to the carrier. The method includes rotating the carrier by 90 degrees and translating the carrier to an opposite side of the imaging tool and moving the samples individually from the carrier to the imaging tool. The method includes imaging a third and fourth side of the sample via the first and second channel of the imaging tool and returning the one or more samples from the imaging tool to the carrier.

System and method for inspection and metrology of four sides of semiconductor devices

An apparatus for automatic pitch conversion for pick and place heads, comprising at least one auto pitch station for adjusting a pitch in a X-coordinate direction and/or adjusting a pitch in a Y-coordinate direction of pickers/grippers of a pick and place heads; a first actuator, operated by a motor gear assembly of the at least one auto pitch station, wherein the first actuator changes the pitch in the X-coordinate direction distance between rows of pickers/grippers of the respective pick and place head; and a second actuator operated by the same motor gear assembly, wherein the second actuator changes the pitch in the Y-coordinate direction between the pickers/grippers within a row of the respective pick and place head. A method for automatic pitch conversion of pick and place heads and a pick and place head and a pick and place device.

Apparatus and method for automatic pitch conversion of pick and place heads, pick and place head and pick and place device

A method for positioning electronic devices into compartments of an input medium is disclosed. At least one electronic device is packable in a single compartment of the input medium. Known positions on an upper side of the input medium are imaged by an inspection device. Actual position data of the compartments of the input medium are calculated on the basis of images of the known positions, given target position data of the known positions, and given target position data of the compartments of the input medium. A pick and place device for the electronic devices is controlled on the basis of the calculated actual position data of the compartments of the input medium. A method for determining the actual positions of compartments of an output medium is disclosed with analogous steps, whereby the electronic devices are picked-up from compartments of the input medium, transferred to compartments of the output medium, and placed into the compartments of the output medium. Arrangements for positioning a plurality of electronic devices into compartments of an input medium and compartments of an output medium are also disclosed.

Method and arrangement for positioning electronic devices into compartments of an input medium and output medium

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Tienen, Belgium

Bert Vangilbergen