Epcos Ag

Tdk Electronics Ag

Bert Hundertmark

Jan Ihle

Benjamin Bohl

Bernhard Ostrick

Christian Wohlgemuth

Andreas Peschka

Bernd Polder

A pressure transmitter is disclosed. In an embodiment a pressure transmitter includes a housing including a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall, wherein the pressure transmitter is configured to determine differential, relative or absolute pressure.

Media-separated pressure transmitter

A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to &#x2212;40&#xb0; C. and less than or equal to 150&#xb0; C.

Pressure sensor system

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Stahnsdorf, Germany

Bert Hundertmark