International Business Machines Corporation

Bert H Newman

Jeffrey Donald Gelorme

Stephen L Buchwalter

Frank Louis Pompeo

Laura Louise Kosbar

Ali Afzali-ardakani

William Miller

John R Behun

Edward L Yankowski

A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.

Cleavable diepoxide for removable epoxy compositions

A low cost process for fabricating solder column interconnectons for an electronic package is described. The process includes the step of filling an array of pin holes in a pin mold with a lead/tin solder, which array of pin holes is in substantial registration with the array of conductive pads on one side of a chip carrier; heating the lead/tin solder in the pin mold such that the solder becomes molten and coalesces with the array of conductive pads of the chip carrier, thereby forming an array of miniature pins bonded to the array of conductive pads of the chip carrier; joining circuit components to the other side of the chip carrier; and reflowing an eutectic lead/tin solder paste screened to the corresponding array of conductive pads of a circuit board to bond the free ends of the array of miniature pins of the carrier to the corresponding array of conductive pads, thereby forming the solder column connnections between the chip carrier and the circuit board. The process is suitable for mass production of reliable, high-density electrical interconnections between a chip carrier and a supporting circuit board.

Process of fabricating a circuit package

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Carmel, NY, United States of America

Bert H Newman