Ixys Semiconductor Gmbh

Bernt Leukel

Andreas Lindemann

The invention relates to a power semiconductor module ( ) having a baseplate ( ) on which at least one substrate ( ) is arranged which is fitted with power semiconductor chips ( ) and can be pressed via pressure elements and contact cords ( ) against the baseplate ( ). The baseplate ( ) has centering elements on which a frame ( ) which defines fields ( ) and is in the form of a grid is provided, with corresponding substrates ( ) with power semiconductor chips being arranged in at least some of the fields ( ), which substrates ( ) can be made contact with via contact rails ( ).

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Hemsbach, Germany

Bernt Leukel