Switch Bulb Company, Inc.

Applied Materials, Inc.

Bernhard Stonas

Glenn Wheelock

Steven Verhaverbeke

Han-Wen Chen

Roman Gouk

Kurtis Leschkies

Kyuil Cho

Giback Park

Jean Delmas

Vincent Dicaprio

Chintan Buch

The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.

Package core assembly and fabrication methods

An LED bulb includes a shell, one or more LEDs, a thermally conductive liquid, and a liquid-volume compensator mechanism. The one or more LEDs are disposed within the shell. The thermally conductive liquid is held within the shell. The liquid-volume compensator mechanism is configured to compensate for expansion of the thermally conductive liquid.

Expandable liquid volume in an LED bulb

An LED bulb includes a base, a shell connected to the base, one or more LEDs, a thermally conductive liquid, and a flexible diaphragm. The one or more LEDs are disposed within the shell. The thermally conductive liquid is held within the shell. The flexible diaphragm is in fluidic connection to the thermally conductive liquid, and is configured to deflect from a first position to a second position to compensate for expansion of the thermally conductive liquid.

An LED bulb includes a base, a shell connected to the base, an LED mount disposed within the shell, one or more LEDs, a thermally conductive liquid, and a liquid-volume compensator mechanism. The one or more LEDs are mounted on the LED mount. The thermally conductive liquid is held within the shell. The liquid-volume compensator mechanism moves from a first position to a second position to compensate for expansion of the thermally conductive liquid.

An LED bulb includes a base, a shell, a plurality of LEDs, a thermally conductive liquid, and a liquid-volume compensator mechanism. The shell is connected to the base. The plurality of LEDs is attached to the base and disposed within the shell. The thermally conductive liquid is held within the shell. The liquid-volume compensator mechanism is attached to the base. The liquid-volume compensator mechanism is configured to compensate for expansion of the thermally conductive liquid. The liquid-volume compensator mechanism moves from a first position to a second position. A first volume is provided for the thermally conductive liquid in the first position. A second volume, which is greater than the first volume, is provided for the thermally conductive liquid in the second position.

Growing community of inventors

Hayward, CA, United States of America

Bernhard Stonas