Siemens Aktiengesellschaft

Infineon Technologies Ag

Bernhard Schätzler

Teck Sim Lee

Georg Ernst

Frank Püschner

Boon Huat Lim

Franz Gabler

Pei Pei Kong

A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

Method of electrically isolating shared leads of a lead frame strip

The invention relates to an electronic component having an integrated circuit being packaged in a housing. The electronic component is adhesively bonded to an island of a leadframe, the island being designed to accommodate the integrated circuit and being dimensionally adapted to the base surface of the integrated circuit in order to minimize and prevent housing deformations.

Electric component with an integrated circuit mounted on an island of a lead frame

Growing community of inventors

Wuppertal, Germany

Bernhard Schätzler