Conti Temic Microelectronic Gmbh

Daimler Chrysler Ag

Temic Telefunken Microelectronic Gmbh

Cpt Zwei Gmbh

Telefunken Electronic Gmbh

Vitesco Technologies Germany Gmbh

Bernhard Schuch

Thomas Schmidt

Matthias Wieczorek

Johannes Bock

Hermann Kilian

Hubert Trageser

Helmut Heinz

Juergen Henniger

Gunter Leicht

Matthias Gramann

Heinrich Acker

Andreas Albert

Hermann Baeumel

Karin Beart

Frieder Wittmann

Friedrich Nehmeier

Martin Steinau

Matthias Keuten

Otmar Bitsche

Joachim Buhl

Klaus Scharrer

Marion Gebhardt

Jürgen Henniger

Peter Mischel

Andreas Plach

Hermann-Josef Robin

Peter Guth

Ulrich Wicke

Ferdinand Friedrich

Tilo Liebl

Turhan Büyükbas

Nikolaus Taschner

Gerhard Bauer

Thomas Urbanek

Mathias Strecker

Werner Graf

Hermann Baumel

Johannes Brunner

Christian Walda

Jan Zenichowski

Andreas Reif

Dominik Klein

Jürgen Sauerbier

Michael Novak

Kurt Geiger

Stefan Gottschling

Juergen Sauerbier

Wolfgang Gruebl

Stefan Müller

Felix Reuning

Andreas Rebelein

Alex Kiess

Susanne Franz

Turhan BÜYÜKBAS

Wolfgang GRÜBL

The disclosure relates to a control device in a motor vehicle. The control device includes a housing cover with a peripheral edge region, and a planar, electrical connecting apparatus with integrated conductor tracks. The housing cover, in the edge region, is cohesively connected at least to the connecting apparatus and forms a cavity with the connecting apparatus. The control device also includes at least one electronic component within the cavity. The connecting apparatus electrically connects the at least one electronic component to electronic components outside the cavity. The housing cover is encapsulated by injection molding in a media-tight manner by a polymer beyond the peripheral edge region.

Media-tight control device for a motor vehicle and method for producing the control device

The disclosure relates to a control device in a motor vehicle. The control device includes a housing cover with a peripheral edge region, and a planar, electrical connecting apparatus with integrated conductor tracks. The housing cover, in the edge region, is cohesively connected at least to the connecting apparatus and forms a cavity with the connecting apparatus. The control device also includes at least one electronic component within the cavity. The connecting apparatus electrically connects the at least one electronic component to electronic components outside the cavity. The peripheral edge region is encapsulated by injection molding in a media-tight manner by a polymer at least in the region of the connecting seam between the housing cover and the connecting apparatus.

Media-tight control device for a motor vehicle

The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side. A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.

Mechatronic component and method for the production thereof

The disclosure relates to a printed circuit board for an electronic component. The printed circuit board includes: an electrically insulating substrate; a number of electrically conductive conductor tracks; and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head. The carrier body is formed integrally with the substrate. The disclosure also relates to a method for producing the printed circuit board.

Printed circuit board and a method for producing a printed circuit board

A control unit device for a motor vehicle includes a circuit board, on which a plurality of electronic components are disposed. The electronic components are electrically coupled to one another by conductor tracks on the circuit board. A substantially gas-impermeable cover is materially joined or bonded to the circuit board in such a way that the cover, together with the circuit board, forms a closed cavity in which the electronic components and the associated conductor tracks are located. A method for producing the control unit device is also provided.

Control unit device for a motor vehicle and method for manufacturing such a device

An arrangement for potential equalization in a control device for a motor vehicle includes at least one electrical component on a circuit carrier, a carrier structure on which the circuit carrier is arranged, and at least one contacting element that electroconductively connects the circuit carrier to the carrier structure by way of a connecting element that forms a potential equalization. The contacting element has a bondable surface coating.

Potential equalization in a control device for a motor vehicle

A housing for an electronic circuit configuration includes a housing seal disposed on an inner surface of the housing, integrally bonded to at least one outer housing wall and made of a liquid silicone elastomer. An electrical connecting element extends from the interior of the housing through an outer housing wall and out of the housing. A space between the outer housing wall and the electrical connecting element is sealed by the housing seal.

Seal for a housing of an electronic circuit arrangement

A circuit device has a base plate, a first substrate arranged on a first outer side of the base plate, a second substrate arranged on a second outer side opposite the first outer side of the base plate, at least one electrical connection element that electrically connects the first substrate and the second substrate, at least one electronic component arranged on or in the first substrate, at least one electronic component arranged on or in the second substrate, a mold package molded around the two substrates and the electronic components arranged thereon, and at least one contacting element for electrically contacting the first substrate and/or the second substrate. The at least one contacting element is electrically conductively connected to the first substrate and/or the second substrate and is led out from the mold package.

Circuit device and method for the production thereof

A control device for a motor vehicle includes a housing having a housing cover and a housing base, a sealing device between the housing cover and the housing base, at least one circuit carrier having electrically conductive tracks, and at least one electronic component disposed on the circuit carrier. The control device further includes at least one conductor structure extending out of the interior of the housing, and at least one electrically conductive connecting line which connects the electronic component to the conductor structure. A getter layer is thermally sprayed on the inner face of the housing to protect the metal parts, which transmit current or data in the interior of the control device, against corrosive gases. The getter layer has a high specific surface area.

Control device with a getter layer for use in a motor vehicle

A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170&#xb0; C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.

Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller

The present system and method relate to an arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area and a method for producing such an arrangement. The flexible foil-type conductor can be easily and flexibly handled and is inexpensive and process-reliable.

Arrangement for electrical and/or mechanical components on a large, flexible foil type conductor area

A circuit board () has a top face () for positioning an electronic component and a bottom face () used as a support on a heat-dissipating base. A plurality of heat transfer holes () provide heat transfer from the top face () to the bottom face (). The heat transfer holes () are unevenly or non-uniformly distributed on the top face () in such a way that the top face () is provided with several free sectors () which are free of heat transfer holes () in order to connect the electronic component to the circuit board (). The free sectors () are configured as columns or lines. A plurality of heat transfer holes () are placed at least along the long sides of the free sectors (). The circuit board has a low thermal resistance between the electronic component and the heat-dissipating base.

Printed circuit board

A power module is suggested having a simple and cost-effective arrangement and ensuring a reliable operation. To this end, a circuit arrangement comprising at least one electronic component is arranged on a carrier body. A conductor pattern is formed on the top side of the carrier body, and a structured cooling element made of the material of the carrier body, is provided on the bottom side. The invention also relates to a power module as power converter for electric motors.

Power module

Electronic packages are produced as follows. Vias in a support body are closed with a highly viscous screen printing material following application of a first metallizing layer forming a base metallization on the support body and in the lead-throughs for the vias. A low viscosity passivating layer, which has been applied on the entire surface of the top and bottom sides of the support body, is selectively removed from certain areas of the top side. A second metailizing layer forming the final metallization of a low-melting point material is applied to the first metallization layer in the areas from which the passivating layer was removed. Electronic components of the circuit arrangement are applied on the top side of the support body and contacted by a soldering process.

Method for the production of an electronic component

The aim of the invention is to simplify and improve the production method for circuit arrangements that are mounted on a support element ( ), said element having thermal through-platings ( ) which are at least partially scaled by a screen printing process. To this end, the screen printing process is carried out after the application of a first metallization layer ( ) to the support element ( ) which forms the base metallization layer, whereby the residue of the screen printing material ( ) remaining on the underside ( ) of the support element ( ) is stripped once the screen printing material ( ) has been cured, using at least a mechanical cleaning process and/or a chemical cleaning process.

Method for producing circuit arrangments

Growing community of inventors

Neusitz, Germany

Bernhard Schuch