Evonik Degussa Gmbh

Evonik Operations Gmbh

Huels Aktiengesellschaft

Bernhard Schleimer

Gabriele Brenner

Nicolai Kolb

Elmar Wolf

Christina Cron

Felix Schmitt

Patrick Glöckner

Joern Volker Weiss

Richard Braunstein

Christina Diehl

The present invention relates to a process for bonding substrates, wherein the bond is a bond that can be released by heat treatment at a temperature of 50° C. to less than 200° C. and a composition is used to produce the bond, said composition containing a polymer of formula (I): Q-(O—C(O)—CR′R″—C(O)—R), where: Q=a polymer group, selected from a polyester group and/or a polyolefin group, wherein the polymer group does not contain any components that result from the use of molecules having (meth)acrylic acid units as monomers; x is greater than or equal to 1; R═Ror O—R; R2=a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms; R3=a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms, or a polymer group; R′=—H, or a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms, or a group of formula (II): —C(O)—NH-Q′, where Q′=an organic group which can also have one or more silicon atoms; and R″=—H or a group of formula (II), with the proviso that if neither of the groups R′ and R″ is a group of formula (II), then at least one of the groups R′ or R″ is —H.

Process for bonding substrates

The present invention relates to a composition comprising the reaction product of a block copolymer based on OH-functional polyolefin which is unhydrogenated, preferably polybutadiene, and cyclic esters in the form of a polyol having at least 1.8, preferably at least two, OH groups and at least one isocyanate compound having at least two isocyanate groups, which is notable in that the composition includes at least 0.0001% to 40% by weight of titanium and has a content of free isocyanate groups of at least 0.1% by weight based on the overall composition, to a process for preparation thereof and to the use of the composition for bonding of substrates.

Reactive adhesives based on block copolymers

The present invention relates to the use of block copolymers produced from OH-functionalized polyolefins and polyesters in adhesives or sealants and to adhesives or sealants containing said block co-polymers.

Use of block copolymers in adhesives

The invention relates to hotmelt adhesives based on polyesters, having low VOC and fogging values. In particular, the invention relates to reactive hotmelt adhesives including polyesters containing at least 50 mole percent, based on the polycarboxylic acid components, of terephthalic acid or a derivative thereof and containing at least 40 mole percent, based on the polyol components, of diols of the formula HO&#x2014;(CH)&#x2014;OH with x&#x2265;6.

Adhesives with low VOC and fogging values

The invention relates to hotmelt adhesives based on polyesters, having low VOC and fogging values. In particular, the invention is directed to a polyester based on polycarboxylic acids and di- or polyols, wherein the polyester including dicarboxylic acids of the formula HOOC&#x2014;(CH2)x-COOH with x&#x3e;10 and diols of the formula HO&#x2014;(CH2)y-OH, with the proviso that at least 50 mole percent of the dicarboxylic acids, based on the total amount of polycarboxylic acid components, and at least 50 mole percent of the diols, based on the total amount of di- or polyols, satisfy the condition x+y&#x3e;18, in hotmelt adhesives.

The present invention relates to the use of polyesters with inherent flame retardancy as or in adhesives, sealants and coatings, to polyesters with inherent flame retardancy and to processes for production thereof.

Use of polyesters having inherent flame protection in adhesives and sealants

Polyamines containing tert-butyl (meth)acrylate groups and having the general formula I ##STR1## wherein R.sup.1 represents a (cyclo)alkylene radical having 2-14 carbon atoms, which may optionally be substituted by 1-3 CH.sub.3 or C.sub.2 H.sub.5 groups and 1-3 CH.sub.2 groups may be substituted by oxygen or --NH--, --NCH.sub.3 -- or --C(O)NH-- groups, R.sup.2 denotes hydrogen or methyl and x may be a number between 1 and 0 with the proviso that 2(1-x).gtoreq.0.1, are effective epoxy curing agents.

Polyamines containing tert-butyl (meth) acrylate groups

A flexible epoxy resin system is prepared by incorporating a combination of hardeners (A) and (B) in an epoxy resin, wherein the amounts of the two hardeners are varied to adjust the flexibility of the epoxy resin.

Growing community of inventors

Marl, Germany

Bernhard Schleimer