Ledvance Gmbh

Infineon Technologies Ag

Osram Gmbh

Hbs Bolzenschweiss-systeme Gmbh & Co. Kg

Bernhard Rieder

Georg Rosenbauer

Walter Hartner

Heinz Lang

Shaozhu Yang

Rainer Markus Schaller

Maciej Wojnowski

Thomas Kilger

Ernst Seler

Ulrich Moeller

Tuncay Erdoel

Horst Theuss

Klaus Elian

Christian Geissler

Moritz Engl

Klaus Eckert

Ran Lin

Henrike Streppel

Jin Hu

Tianzheng Jiang

Xiongqiang He

Michael Rosenauer

Andreas Hammer

Florian Wagner

Thomas Heil

Yonggang Xiao

Christian Dendorfer

Georg Scheipl

Christoph Strauß

A gas sensor comprises a substrate, a first semiconductor-based sensor element for determining the density and/or viscosity of a gas, which element is arranged above the substrate and which has a resonant element, and a cover arranged above the first sensor element, wherein the substrate and/or the cover has an opening to allow the passage of a gas to the first sensor element.

Gas sensor with a resonant element, method for producing the same and use of the same for detecting gases

A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

Radio-frequency devices and methods for producing radio-frequency devices

A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.

Radio-frequency device comprising semiconductor device and waveguide component

A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Chip package with substrate integrated waveguide and waveguide interface

A radar chip package includes a radar monolithic microwave integrated circuit (MMIC) having a backside, a frontside arranged opposite to the backside, and lateral sides that extend between the backside and the frontside, wherein the radar MIMIC comprises a recess that extends from the backside at least partially towards the frontside; a plurality of electrical interfaces coupled to the frontside of the radar MIMIC; at least one antenna arranged at the frontside of the radar MIMIC; and a lens formed over the recess and the at least one antenna, wherein the lens is coupled to the backside of the radar MMIC.

Radar package with optical lens for radar waves

A radio frequency (RF) device includes a conformal RF antenna configured to be mounted on a non-metallic component of a vehicle and configured to operate at frequencies greater than 10 GHz. The RF device further includes an RF chip mounted on the conformal RF antenna and electrically coupled to the conformal RF antenna to transfer an RF signal of a frequency greater than 10 GHz to the conformal RF antenna.

RF devices including conformal antennas and methods for manufacturing thereof

A radio-frequency device comprises a printed circuit board and a radio-frequency package, which is mounted on the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point. The radio-frequency device further comprises a waveguide component, which is mounted on the printed circuit board at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide. The printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, wherein the second elasticity is higher than the first elasticity.

Radio-frequency devices and associated production methods

A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.

RF devices including an RF chip having an electrical redistribution layer with RF antennas formed therein and methods of manufacture

A light fixture has a translucent tubular bulb. At least one end cap is located at one end of the translucent tubular bulb. A light engine is disposed in the translucent tubular bulb. The light engine has a leadframe on which a plurality of semiconductor light elements is arranged. The fixture may include an electronic driver. The electronic driver includes a plurality of electronic components. At least one of the plurality of electronic components is arranged inside the transparent tubular bulb.

Tube lamp with leadframe

An LED illumination device corresponds to a compact fluorescent lamp and has improved thermal properties. The illumination device includes a transparent tube having an inner wall defining a cavity, a light engine having one or more light emitting diodes, and a driver to drive the light engine. The light engine is disposed at the inner wall of the transparent tube. The arrangement of the light engine and the one or more light emitting diodes at the inner wall of the tube provides improved lighting characteristics. Simultaneously, an improved cooling is provided by the interface surface for conducting heat between the inner wall and the light engine.

Illumination device with LED strip light engine configured for retrofitting pin-based CFL socket

A radio-frequency device comprises a radio-frequency chip, a first connecting element arranged over a chip surface of the radio-frequency chip, the first connecting element being designed to mechanically and electrically connect the radio-frequency chip to a circuit board, and a radio-frequency signal carrying element arranged over the chip surface and electrically coupled to the radio-frequency chip, the radio-frequency signal carrying element being covered by an electrically nonconductive material and being designed to transmit a signal in a direction parallel to the chip surface, wherein the first connecting element and the radio-frequency signal carrying element are arranged at a same level in relation to a direction perpendicular to the chip surface, and wherein the first connecting element is spaced apart from the radio-frequency signal carrying element by way of a region that is free of the electrically nonconductive material.

Radio-frequency device with radio-frequency signal carrying element and associated production method

A method for producing a tube lamp uses at least one leadframe. A leadframe is a flat structure which has two opposing surfaces extending substantially parallel and spaced apart by the sheet thickness. One or more stabilizing sections are applied to the leadframe. The leadframe is fastened with the stabilizing sections in a tubular housing of the tube lamp.

Method for producing a tube lamp and corresponding tube lamp

An LED light fixture, includes a bulb, a light module with at least one light emitting diode chip which is mounted on a circuit board by means of chip-on-board assembly, and a driver of the light module, wherein the light module and the driver electronics are received in the bulb. The LED light fixture may be arranged within an enclosure to form an LED lamp.

Glass lamps containing COBs with integrated electronics

A light emitting diode (LED) module is disclosed having an elongated flat support with a first long end, a second long end opposite the first long end, and electrically conductive regions. The disclosed LED module includes at least one LED mounted on the flat support as well as an electronic driver with at least one electronic driver component mounted on the flat support for driving the at least one LED. The electrically conductive regions have a first pair of contact points on one of the two long ends for connection of the LED module to a current source and a second pair of contact points on one of the two long ends for connection of a smoothing capacitor on the LED module.

Growing community of inventors

Wuppertal, Germany

Bernhard Rieder