Epcos Ag

Tdk Electronics Ag

Siemens Aktiengesellschaft

Micronas Gmbh

Bernhard Ostrick

Jan Ihle

Bettina Milke

Peter Balzer

Hans Meixner

Maximilian Fleischer

Roland Pohle

Elfriede Simon

Oliver Bard

Wolfgang Grundmann

Benjamin Bohl

Anke Weidenfelder

Carsten Dehoff

Andreas Peschka

Bert Hundertmark

Martin Zimmer

Jeffrey Krotosky

Michael Schiffer

Wolfgang Schreiber-prillwitz

Hans Prof Meixner

Hans Prof-Dr Meixner

In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

Sensor element and method for producing a sensor element

A film resistor and a thin-film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer including a first transition metal carbide.

Film resistor and thin-film sensor with a piezoresistive layer

A film resistor and a film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer comprising a MAXphase, wherein M comprises at least one transition metal, A comprises a main-group element, and X comprises carbon and/or nitrogen, and wherein n=1, 2 or 3.

Film resistor and thin-film sensor

A sensor module has a first sensor element and a second sensor element. The first sensor element and the second sensor element are accommodated in a common housing of the sensor module. The sensor module includes a conductor structure that comprises an electrode structure and a separate connection structure. The connection structure is connected in an electrically conductive manner to the first sensor element and the electrode structure is allocated to the second sensor element.

Compact sensor module for a combination of pressure, humidity and/or temperature sensors

A device, an arrangement, and a method for measuring a current intensity in a primary conductor through which current flows are disclosed. In an embodiment, an apparatus includes a magnetic field-generating element configured to generate a reference magnetic field; and a magnetic field angle-sensitive element configured to measure an orientation of a total magnetic field, the total magnetic field is produced by overlapping of the primary magnetic field and the reference magnetic field in space, wherein the primary magnetic field and the reference magnetic field are not parallel to one another at a location of the magnetic field angle-sensitive element, and wherein the current intensity of the current flowing through the primary conductor is determinable from the orientation of the total magnetic field in space.

Device, arrangement, and method for measuring a current intensity in a primary conductor through which current flows

A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to &#x2212;40&#xb0; C. and less than or equal to 150&#xb0; C.

Pressure sensor system

A temperature-measuring device with a sensing head and a pipe piece is disclosed. The sensing head is embedded in the pipe piece. The pipe piece is provided for conducting a medium whose temperature is detected by the sensing head.

Temperature-measuring device

A probe includes a sensing element and a carrier for the sensing element. The carrier has an integrated device for guiding an air stream to the sensing element, and a long axis perpendicular to a plane defined by the flow direction of the air stream. The probe is substantially symmetric with respect to the plane.

Probe

An ozone sensor has an ozone-sensitive layer containing an ozone-sensitive material which is encapsulated in a polymer or in a polymer mixture or is coated by at least one polymer or polymer mixture. Advantages result from a longer service life of the ozone-sensitive materials which, because of their high hygroscopic properties, would not be stable without encapsulation or coating. Furthermore, a polymer matrix can be selectively used as a filter or in order to eliminate interfering influences.

Growing community of inventors

Teltow, Germany

Bernhard Ostrick