Lam Research Ag

Bernhard Loidl

Bhaskar Bandarapu

Hongbo Si

David S Mui

Andreas Gleissner

Butch Berney

Karl-Heinz Hohenwarter

Christian Putzi

Robert Johnson

Nathan Lavdovsky

Michael Klemm

A vapor delivery head for wet treatment of a substrate includes a body including an upper surface, a lower surface, an upper plenum and a lower plenum. A first bore is arranged on the upper surface of the body and fluidly connected to the upper plenum to supply heated fluid. A second bore is arranged on the upper surface of the body and connected to the upper plenum to remove heated fluid. A third bore is arranged on the upper surface of the body and connected to the lower plenum to receive a gas mixture. A plurality of through holes through the lower surface of the body are in fluid communication with the lower plenum.

Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures

In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.

Method and apparatus for processing wafer-shaped articles

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Villach, Austria

Bernhard Loidl