Infineon Technologies Ag

Infineon Technologies Austria Ag

Bernhard Knuepfer

Bernd Klehn

A die according to an embodiment includes a contact pad configured to provide an electrical contact to a circuit element included in the die, a lateral edge closest to the contact pad and a cover layer including a protective structure, the protective structure including at least one elongated structure, wherein the cover layer includes an opening providing access to the contact pad to couple the contact pad electrically to an external contact, wherein the protective structure is arranged between the lateral edge and the contact pad. Using an embodiment may reduce a danger of contamination of a top side of a die during fabrication and packaging a chip.

Die and chip

A measuring device has a needle-board circuit board carrying a large number of contact-making needles for contacting connecting areas on an IC circuit. The measuring device has lines for feeding test signals at a high clock frequency to the contact-making needles, and for carrying measured signals away from the contact-making needles. The needles have a shank part with a length L and a tip part adjacent thereto with a length L For optimally transmitting signals in terms of impedance, the lines are formed as dual-transmission conductor tracks, the shank parts of the contact-making needles each contact a section of the conductor tracks, and the overall length of the contact-making needles satisfies: L L where &lgr; is the maximum wavelength of the signal that is transmitted via a respective line.

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Otterfing, Germany

Bernhard Knuepfer