Infineon Technologies Ag

Avago Technologies International Sales Pte. Limited

Avago Technologies Wireless IP (singapore) Pte. Ltd.

Bernhard Gebauer

Martin Handtmann

Martin Franosch

Klaus-Guenter Oppermann

Lueder Elbrecht

Martin Fritz

Oliver Wiedenmann

Jyrki Kaitila

Robert Thalhammer

Sarah Kay Haney

Deog-Soon Choi

Ngoc-Hoa Huynh

Ji-Fuh Liang

Aaron Lee

Hans-Peter Forstner

Sergej Scherer

Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.

Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) module

An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.

Frame elements for package structures comprising printed circuit boards (PCBs)

A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.

Method for housing an electronic component in a device package and an electronic component housed in the device package

A duplexer includes first and second acoustic filters and a phase shifter. The first acoustic filter is connected between an antenna and the transmitter, and has a first passband. The second acoustic filter is connected between the antenna and the receiver, and has a second passband. The phase shifter includes at least one series capacitor connected in series with the antenna and at least one shunt inductor connected between the at least one capacitor and ground. The phase shifter is connected between the antenna and the first filter when the first passband is higher than the second passband, and provides a negative phase shift of an output impedance of the first filter. The phase shifter is connected between the antenna and the second filter when the second passband is higher than the first passband, and provides a negative phase shift of an input impedance of the second filter.

Duplexer with negative phase shifting circuit

An apparatus includes a stacked crystal filter and a bulk acoustic wave resonator, which are acoustically coupled.

Bulk acoustic wave device

An antenna multiplexer with a pi-network circuit is described, having an inductance connected in series and, on each of the two connection sides of the inductance, a capacitance connected in parallel. The pi-network circuit is used for effecting an impedance mismatch of a signal path of the antenna multiplexer.

Antenna multiplexer with a Pi-network circuit and use of a Pi-network

Growing community of inventors

Tuntenhausen, Germany

Bernhard Gebauer