Snaptrack Incorporated

Epcos Ag

Bernhard Bader

Andreas Link

Maximilian Pitschi

Gudrun Henn

Maximilian Schiek

Tomasz Jewula

Christian Ceranski

Andreas Tag

In order to improve heat dissipation from electrical components with heat-generating component structures, it is proposed to provide a radiation layer with a large surface in the area of the component structures. Preferably, the radiation layer is very heat-conductive or in heat-conductive connection with the component structures.

Electrical component with heat dissipation

The invention relates to a BAW resonator with reduced heat build-up. The heat build-up is reduced by a thermal bridge, which dissipates heat from the electro-acoustically active region to a support substrate, without impairing the acoustics of the resonator.

BAW resonator with reduced heat build-up, HF filter comprising BAW resonator, duplexer comprising HF filter, and production method

A microacoustic component includes a functional acoustic region, an inner marginal region and an outer marginal region. The cover covers the functional acoustic region and has a thin film and a bearing surface. The inner marginal region is acoustically coupled to the functional acoustic region and the bearing surface bears directly at least on a part of the inner marginal region.

Microacoustic component and method for the production thereof

A duplexer includes an antenna terminal, a transmission amplifier terminal and a reception amplifier terminal. The transmission amplifier terminal is coupled to the antenna terminal via a transmission filter. The reception amplifier terminal is coupled to a reception filter and the reception filter is coupled to the antenna terminal via a band-stop filter.

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Neubiberg, Germany

Bernhard Bader