The Whitaker Corporation

Tyco Electronics Corporation

Mia-Com, Inc.

Bernhard Alphonso Ziegner

Robert John Sletten

Noyan Kinayman

Eswarappa Channabasappa

Richard Alan Anderson

Nitin Jain

May Cho

Stephen Robert Brown

Thongchai Hongsmatip

Eric Andrew Soshea

Steve Robert Brown

Walter Leo Storkus

Flexible multilayer microwave or mm-wave circuits and sensors are provided having at least (a) a first metallization layer, at least a portion of the first metallization layer being adapted for operation at a frequency ranging from 20 GHz to 100 GHz; (b) a second metallization layer, at least a portion of the second metallization layer being adapted for operation as a ground plane; (c) a dielectric substrate layer, the dielectric substrate layer being disposed between the first and second metallization layers; and (d) a plurality of conductive vias extending through the dielectric substrate layer and electrically connecting portions of the first and second metallization layers.

Film-based microwave and millimeter-wave circuits and sensors

A spatial power divider/combiner that comprises: a housing containing a first channel forming three sides of a rectangular input waveguide and a second channel forming three sides of a rectangular output waveguide; a board coupled to the housing, wherein the underside of the board forms the fourth side of the input and output waveguides; a series of slots etched on the underside of the board located in the input waveguide to divide an input signal; a series of slots etched on the underside of the board located in the output waveguide to recombine the divided signal; and a series of microstrip lines printed on the top side of the board to couple the input waveguide and the output waveguide. Additionally, the divider/combiner can comprise a series of active devices, such as MMIC power amplifier, to provide a spatial power amplifier.

Compact slotted-waveguide spatial power divider/combiner/amplifier

A surface-mountable mm-wave signal source is provided. The surface-mountable mm-wave signal source comprises: a conductive metal base; a mm-wave signal source disposed over an upper portion of the metal base; a first radio frequency transmission line carrying a quasi-TEM signal from the mm-wave signal source, which is disposed over an upper portion of the metal base and proximate the signal source; a first mode transformer at least partially integrated into the upper portion of the metal base to convert the quasi-TEM signal carried by the planar transmission line into a rectangular waveguide mode signal; a waveguide well having upper and lower ends disposed within the base for carrying the rectangular waveguide mode signal from an upper portion of the base to a lower portion of the base; and a second mode transformer at least partially integrated into the lower portion of the base to convert the rectangular waveguide mode signal to a quasi-TEM signal within a second radio frequency transmission line. The mm-wave signal source preferably operates in a frequency range of from 35 to 94 GHz, more preferably a frequency range of 70 to 80 GHz.

Surface-mounted millimeter wave signal source with ridged microstrip to waveguide transition

An antenna has a relatively thick primary dielectric between a ground plane and a conducting radiating element being fed by a conducting transmission line, first and second thin dielectrics on opposite sides of the primary dielectric, the relatively thick primary dielectric having a relatively lower dielectric constant than that of at least the second thin dielectric to increase the bandwidth transmission capability of the transmission line for a given impedance, the second thin dielectric couples substantially less power than is coupled with the primary dielectric and the second thin dielectric is of relatively higher dielectric constant promoting surface wave coupling and reduction of wave losses.

Low cost reduced-loss printed patch planar array antenna

A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).

Millimeter wave module with an interconnect from an interior cavity

An IC package appropriate for microwave devices, integrated circuits, multichip modules, and hybrid circuit assemblies and power devices comprises an outer interconnect (2) and an inner interconnect (3). Lead lines (8) on an outer interconnect (2) are in electric engagement with respective access lines (13) on an inner interconnect (3). Contacts (21) of an IC are electrically interconnected with the access lines (13) on the inner interconnect (3). A package according to the teachings of the present invention provides for efficient heat dissipation from the package interior and an efficient electrical transition from the interior of a package.

Growing community of inventors

Tyngsborough, MA, United States of America

Bernhard Alphonso Ziegner