Qimonda Ag

Flexenable Limited

Bernd Zimmermann

Martin Reiss

Thorsten Schedel

Octavio Trovarelli

Stefan Ruckmich

Volker Berghof

A method comprising forming on a common support () one or more series of multi-layer electronic devices (covering the areasrespectively), and then separating the electronic devices; wherein the devices comprise one or more organic layers (), and the method comprises depositing one or more of the organic layers () as a respective continuous layer extending at least from one end of the one or more series of devices to an opposite end of the one or more series of devices.

Electronic devices including organic materials

Interconnect structures and methods are disclosed. In one embodiment, an interconnect structure includes a via extendable through a workpiece from a first side of the workpiece to a second side of the workpiece. The via is partially filled with a conductive material and has sidewalls. The interconnect structure includes a contact coupled to the conductive material in the via proximate the first side of the workpiece. The conductive material in the via comprises a recessed region comprising a landing zone proximate the second side of the workpiece.

Interconnect structures and methods

In a method of making an electronic component, an electrically conductive redistribution line is formed on a surface of a semiconductor chip. The redistribution line includes a solder pad. A covering material is formed over the solder pad and an uncovered portion of the redistribution line is passivated. The covering material prevents passivation of the solder pad. Solder is then formed over the solder pad such that the uncovered portion of the redistribution line has solder resist properties due to the passivating.

Growing community of inventors

Dresden, Germany

Bernd Zimmermann