Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Richard Wolf Gmbh

Bernd Wagner

Rolf Hagedorn

Thomas Lisec

Gunter Fuhr

Hans Joachim Quenzer

Hans-Joachim Quenzer

Wolfgang Benecke

Ulrich Hofmann

Andreas Voigt

Roland Sittig

Detlef Nagel

Jan Hornung

Ralf-Ulrich Dudde

Klaus Reimer

Marc O Schurr

Gerhard F Buess

Gerhard J Muller

Thomas Schnelle

Guenter R Fuhr

Peter Merz

Marten Oldsen

Steffen Howitz

Kaspar Dutting

Arne Schulz

Stefan Fiedler

Jan Gimsa

Roland Glaser

Xihe Tuo

Henning Glasser

Beatrice Wenk

Torsten Mueller

Martin Kreutzer

Thorsten Muller

Arne Veit Schulz

The invention relates to a micromechanical actuator, especially a micro-mirror scanner, comprising an actuator unit in an outer frame which unit is suspended in the outer frame via two torsion elements, and electrostatic tilt drives from intermeshing first and second comb-type electrodes which are off-set from each other vertically. The first electrodes are rigidly connected to the outer frame and the second electrodes to the outer frame via an outer connecting element and to the actuator unit via an inner connecting element. The inner connecting element has a spring which extends in parallel to the outer tilting axis, which is connected to the same in a section of the actuator unit close the outer tilting axis, and which is designed and arranged to be rigid in the vertical direction and flexible at a right angle to the vertical direction. The micromechanical actuator according to the invention allows the use in a micro-mirror scanner whose slow axis is non-resonantly driven with excursions of &#x3e;+/&#x2212;7&#xb0;, lateral mirror sizes having dimensions of 1 mm and more and a resonant frequency of &#x3e;1 kHz and can be integrated even into flat mobile phones.

Electrostatic comb-drive micromechanical actuator

Disclosed is a method for structuring a flat substrate consisting of a glass-type material. The invented method is distinguished by a combination of the following steps: providing a semiconductor flat substrate consisting of a semiconductor material, structuring at least one surface of said semiconductor flat substrate to obtain recesses in said surface, connecting said surface of said semiconductor flat substrate to said glass-type flat substrate, with said structured surface of said semiconductor flat substrate being connected to a surface of said glass-type flat surface at least partially covering the same,tempering said connected flat substrates in such a manner that at least a part of the said glass-type material flows into said recesses of said structured surface of said semiconductor flat substrate,removing material at least from the resolidified glass-type flat substrate in such a manner that said glass-type flat substrate assumes a surface which is flush with said structured surface of said semiconductor flat substrate.

Method for structuring a flat substrate consisting of a glass-type material

The invention relates to a semiconductor component which is capable of blocking such as an (IGBT), a thyristor, a GTO or diodes, especially schottky diodes. An insulator profile section () provided in the border area of an anode metallic coating () is fixed (directly in the edge area) on the substrate () of the component. The insulator profile has a curved area (KB) and a base area (SB), said curved area having a surface (OF) which begins flat and curves outward and upward in a steadily increasing manner. A metallic coating (MET) is deposited on the surface (OF). Said coating directly follows the surface curvature and laterally extends the inner anode metallic coating. The upper end of the curved metallic coating (MET. . . ) is distanced and insulated from one of these surrounding outer metallic coatings (MET) by the surrounding base area (SB) of the insulator profile () such that an extensively constant course of the line of force which evades extreme values results between both metallic coatings (, MET, MET) when reverse voltage or blocking voltage is applied between the interspaced metallic coatings.

Termination of semiconductor components

A tunable high-frequency capacitor includes first and second fixed electrodes, the first fixed electrode having a high-frequency input connection, and the second fixed electrode having a high-frequency output connection. A movable electrode is arranged facing and spaced apart from the fixed electrodes and is supported by means of a suspension which causes a displacement of the movable electrode in relation to the fixed electrode depending on a control signal that is applied.

Tunable high-frequency capacitor

A sensor element for electrically measuring the position of liquid levels, comprising a substrate ( ) and a plurality of electrodes ( ) that can be contacted individually and that are mounted on the substrate, characterized in that the electrodes comprise sensor-active partial electrodes ( ) that are networked with electrical connections ( ), with the partial electrodes of two respective electrodes always being positioned opposite one another, separated by a distance, as partial electrode pairs ( ) and with the electrode pairs ( ) thus formed recurring periodically over the length of the sensor. Quasi-digital measuring methods are derived from the behavior of the impedance of the electrode pairs, whereby the liquid level is measured by detecting a conductivity boundary in a capillary filling.

Microsensor for measuring the position of liquids in capillaries

Assembly having variable capacitance

The invention relates to a micro reactor arrangement, particularly for a micro relay. It comprises a substrate ( ) with two thermomechanical micro actuators ( ). In response to thermal stimulation, the first micro actuator ( ) performs a movement in parallel with the substrate surface ( ), while the second micro actuator moves in a direction orthogonal on the substrate surface ( ). Both thermomechanical micro actuators are so disposed relative to each other that the first micro actuator ( ), in the extended state, reaches under the second micro actuator ( ). With these provisions, the first micro actuator ( ) can be maintained in this position without supply of power when the second micro actuator ( ) is de-energized. With the present micro actuator arrangement, one can achieve the advantages of a high activation force and long positioning travels of thermomechanical micro actuators for micro relays, without the necessity to supply energy for maintaining the individual switching states.

Microactuator arrangement

A micromechanical pump has a membrane ( ) positioned above a substrate ( ). The substrate is provided with a cavity ( ) which is formed in an endlessly continuous shape (e.g., circular) to provide a channel for a drive fluid. A cover ( ) is positioned above the substrate with the membrane being between the substrate and cover. The cover is provided with an inlet ( ) and outlet ( ). Electrodes ( ) are provided around the floor of the cavity. The electrodes are selectively actuated so as to attract selected areas of the membrane resulting in a gap forming between the cover and the selected areas of the membrane. The areas of the membrane above the non-selected electrodes form a seal with the cover. By selectively actuating the electrodes a peristaltic pumping action results in a pumped fluid traveling from the inlet, through the gaps and out the outlet.

Micromechanic pump

The invention relates to a semiconductor component which is capable of blocking such as an (IGBT), a thyristor, a GTO or diodes, especially schottky diodes. An insulator profile section ( ) provided in the border area of an anode metallic coating ( ) is fixed (directly in the edge area) on the substrate ( ) of the component. The insulator profile has a curved area (KB) and a base area (SB), said curved area having a surface (OF) which begins flat and curves outward and upward in a steadily increasing manner. A metallic coating MET ) is deposited on the surface (OF). Said coating directly follows the surface curvature and laterally extends the inner anode metallic coating. The upper end of the curved metallic coating (MET . . . ) is distanced and insulated from one of these surrounding outer metallic coatings (MET ) by the surrounding base area (SB) of the insulator profile ( ) such that an extensively constant course of the line of force which evades extreme values results between both metallic coatings ( , MET , MET ) when reverse voltage or blocking voltage is applied between the interspaced metallic coatings.

Optimized border of semiconductor components

A bistable electrostatic actuator with pneumatic or liquid coupling. The actuator has enclosed metallic electrodes. It can be used for a microvalve or micropump. The actuator has buckled membrane sections in pairs and curved substrate electrodes, locally associated with said membrane sections.

Bistable microactuator with coupled membranes

Disclosed is a process for manipulating microscopic dielectric particles in which particles are exposed to an electric field. In disadvantaged processes the particles are exposed to inhomogeneous electric field and are polarized by them. The polarized particles are moved in the direction of higher field strength. These processes permit no reversal of the traveling direction of the particles. The particles are enriched at the electrode so that they cannot be retained in free space. In the invented process the particles are exposed to high-frequency field traveling in one or more prescribed direction, by which the particles are subject to a force which sets them in a motion that is strongly synchronous to the field. With the aid of a device for carrying out the invented process, the particles can be manipulated very flexibly. By means of linearly or circularly disposed electrodes, the particles can be moved on linear paths in any direction including through branched microstructures, they can be separated according to their dielectric properties and retained without contact. Applications are in the fields of biotechnology and molecular separation, focussing and microtransport technology.

Process for manipulating microscopic, dielectric particles and a device

Valve arrangement, especially for a pneumatic control system

Ultraminiaturized surface structure with controllable adhesion

The device comprises a treatment laser and at least two diagnosis lasers of differing wavelengths, wherein a receiving means is allocated to each diagnosis laser. The signal of the receiving means is led to an electronic evaluation and control means. In the distal end section of the endosopic part of the device the light beams of all lasers are guided together.

Device for endoscopic diagnosis and treatment of tissue

Shaping of microparticles in electric-field cages

Growing community of inventors

Looft, Germany

Bernd Wagner