Siemens Aktiengesellschaft

Bernd Thyzel

Klaus Weber

Olaf Lucke

Erich Mattmann

Waldemar Brinkis

Arthur Sch&auml;fert

J&uuml;rgen Irion

An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a sintered electrically insulating polymer layer on which the conductor track system, which comprises a sintered glass frit with a noble metal filling, is arranged.

Electronics unit

The invention relates to a power electronics component that comprises a planar ceramics substrate () on whose one face condutor tracks (), applied in thick-film technique, are disposed for electrically connecting electrical power components () of a circuit that are also disposed on the ceramics substrate (). The ceramics substrate (), with its other face, is brazed onto a metal a metal support element () that serves as a heat spreader. The support element () is linked with a thermoconducting housing part housing that accommodates the support element () in a thermoconductive manner. On the face of the support element () facing away from the ceramics substrate (), approximately opposite the ceramics substrate (), a second ceramics substrate () is brazed onto the ceramics substrate () that carries the circuit and has approximately the same dimensions.

Power electronics component

The invention relates to a power electronics component that comprises a support element on which conductor tracks () are disposed for electrically connecting the electrical power components () that are also disposed on the support element and the control components of a circuit. The support element is linked with a thermoconducting housing part of a housing that accommodates the support element in a thermoconductive manner. The support element consists of a porous, ceramics component whose pores are filled with metal and which is covered by a thick-film dielectric on which the conductor tracks (), in the form of thick-film conductor tracks, and the power components () are disposed, and the conductor tracks () arm connected to the electrical power components () in a electroconductive manner. The support element is disposed to rest against the housing component.

A power electronics unit with a sheet-like carrier element, on which interconnects are arranged for the electrical Connection of electrical power components and control components of a circuit, likewise located on the carrier element. The carrier element is a heat sink , on which the interconnects have been applied by a heat-conducting adhesive , and a minimum thickness of the heat-conducting adhesive to allow the heat-conducting adhesive to be an electrical insulating layer is ensured by spacers in the heat-conducting adhesive

Growing community of inventors

Schlossborn, Germany

Bernd Thyzel