Infineon Technologies Ag

Siemens Aktiengesellschaft

Bernd Stadler

Horst Theuss

Stefan Paulus

Albert Auburger

Jochen Dangelmaier

Thies Janczek

J&uuml;rgen Winterer

Achim Neu

Eric Bootz

Ralf Otremba

Gottfried Beer

Klaus Schiess

Uwe Wahl

Dominic Maier

Thomas Kilger

Detlef Houdeau

Reinhard Losehand

Frank Daeche

Michael Weber

Ulrich Wachter

Jens Krause

Josef-Paul Schaffer

Martin Petz

Oskar Neuhoff

Andreas Schlögl

Veronika Huber

Jurgen Winterer

Martin Schroeder

Volker Geungerich

Christian Gottswinter

A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.

Sensor module

A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame.

Molded semiconductor package with backside die metallization

A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.

Module including a micro-electro-mechanical microphone

A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and second semiconductor chips are respectively received in the first and second recesses.

Chip carrier and system including a chip carrier and semiconductor chips

The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips.

Module comprising a semiconductor chip comprising a movable element

A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.

Digital camera with a transparent core disposed between a lens and a light-sensitive sensor

A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

An electronic sensor device has at least one sensor component, which bears on a bearing base of a rewiring structure. Contact areas of the sensor component are electrically conductively connected to contact pads of the rewiring structure. External contact areas of the rewiring structure are led outward from a housing for the electrical contact-connection of the electronic sensor device. A method is also described for producing the electronic sensor device.

Electronic sensor device and method for producing the electronic sensor device

An electronic device has a semiconductor chip and a passive component, whose electrical values can be varied. The semiconductor chip is electrically conductively connected to a rewiring structure that, together with the semiconductor chip and with the passive component, is enclosed by a housing made of plastic. A method for producing the electronic device is also described.

Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device

The covering device covers a ceramic module with electronic components arranged between a ceramic substrate and an upper covering plate of the covering device. The covering device is spaced apart by spacers from the surface of the ceramic substrate fitted with components. The covering device is fixed on the ceramic module by snap-in elements which engage in lateral cutouts in the ceramic substrate.

Covering device for ceramic modules

A handling and mounting protection device is described that has a cap-shaped configuration with a covering layer which covers a contact-sensitive upper side of a component which is to be protected. Extending from the covering layer are locking arms with locking hooks which, in the state in which they are fitted onto the component, engage behind undercuts in the component in such a way that even after the component has been mounted they can still be released from it.

Handling and mounting protection device

The pressure sensor component has a chip carrier carrying a semiconductor chip with an integrated pressure sensor having a pressure-detecting surface exposed to the pressure to be measured. A device encapsulation made from an electrically insulating material surrounds the entire assembly except for protruding electrode terminals. Bond wires connect the electrode terminals with the pressure sensor and/or the electronic circuit of the semiconductor chip. The device encapsulation consists entirely of a homogeneous pressure-transmitting medium comprising an enveloping compound, which transmits the pressure to be measured as free from delay and attenuation as possible but is mechanically resistant and dimensionally stable. The pressure to be measured is transmitted directly by the enveloping compound onto the pressure-detecting surface of the semiconductor chip, and the pressure sensor and/or the pressure sensor component is covered tightly on all sides against mechanical and/or chemical influences.

Pressure sensor component

The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be measured. The component is encapsulated with electrically insulating material that encloses the semiconductor chip and/or the chip carrier at least in regions. A chimney-shaped connection piece that projects up relative to the pressure-detecting area of the pressure sensor penetrates through the encapsulation and is connected to the pressure sensor. The connection piece, which is a separate structural element is incorporated in the component encapsulation and it encloses at least the pressure-detecting surface area in a pressure-tight manner with its end bearing on the semiconductor chip. The connection piece is open toward the outside at its opposite end so as to expose the pressure sensor to the pressure to be measured. The invention furthermore relates to a method for producing such a pressure sensor component.

Pressure sensor component and production method

A housing for a semiconductor sensor configuration, in which a sensor and an evaluation logic are integrated in a semiconductor body is disclosed. The housing has a base body upon which the semiconductor body is applied and a cover that encloses the semiconductor body in the base body. The cover is directly set on the base body of the housing and contains a membrane and/or labyrinth.

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Donaustauf, Germany

Bernd Stadler