Ga-tek, Inc.

Bernd Schneider

R Richard Steiner

A method of forming a laminate used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chromium having a thickness from about 30 grams per square meter to about 160 grams per square meter to each side of a steel substrate having a thickness from about 0.10 mm to about 0.20 mm. Applying a layer of copper having a thickness from about 2 &mgr;m to about 70 &mgr;m to each of the chromium layers. Positioning the steel substrate between two dielectric layers with adhesive disposed between the copper layers and the dielectric layers. Applying heat and pressure to the layers to bond the copper layers to the dielectric layers. Separating the steel substrate from the copper layers, and discarding the steel substrate.

Component of printed circuit board

A component for use in manufacturing articles, such as printed circuit boards, comprising a laminate constructed of a sheet of copper foil that, in a finished circuit board, constitutes a functional element, and a sheet of carbon steel having a layer of an inert metal thereon, the sheet of carbon steel constituting a discardable element. One surface of the copper sheet and the surface of the inert metal layer on the carbon steel sheet are essentially uncontaminated and engageable with each other at interfaces. The copper sheet is attached to the inert metal layer of the carbon steel sheet at their borders and defines substantially uncontaminated central zones inwardly of the edges of the sheets that are unjoined at the interfaces.

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March-Holzhausen, Germany

Bernd Schneider