Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Bernd Sauter

Georg Pietsch

Dieter Seifert

Ernst Feuchtinger

A method for manufacturing a semiconductor wafer which is coated on one s and provided with a finish has a) the semiconductor wafer being subjected to a first treatment (double-sided finish) which produces a finish on both sides of the semiconductor wafer at the same time; has b) at least one coating being produced on one side of the semiconductor wafer; and has c) the semiconductor wafer being subjected to a second treatment which produces a double-sided finish.

Method for manufacturing a semiconductor wafer which is coated on one

A carrier for a semiconductor wafer has at least three protrusions on which he edge of the semiconductor wafer is supported so that the semiconductor wafer is positioned essentially horizontal. The carrier does not make contact with the front side and the rear side of the semiconductor wafer. The protrusions are shaped so that the edge of the semiconductor wafer is supported exclusively below an imaginary central plane in the center between the front side and the rear side of the semiconductor wafer. The carrier is preferably used in the treatment of semiconductor wafers at temperatures of at least 200.degree. C.

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Emmerting, Germany

Bernd Sauter